Distinguished Engineer, Advanced Package Technology

Marvell Technology

Develop packaging technology for AI and high performance computing solutions at Marvell. Lead projects involving innovative design and collaboration with cross-functional teams.

Posted 5/12/2026full-timeChandler • Arizona, California, Texas • 🇺🇸 United StatesSeniorLead💰 $222,800 - $329,670 per yearWebsite

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Develop packaging technology roadmap for AI XPU, XPU-attach and Switch
Explore technologies beyond what is currently available, make recommendations, and create and protect IP to maximize performance.
Create new package technology concepts from open ended ideas, perform routing feasibility, signal and power integrity studies for design optimization.
Explore technology feasibility and create proof-of-concept samples and productize technologies.
Define package architecture including chiplet topology, interposer/substrate scaling, power delivery network strategy, and thermal design envelope.
Lead co-design efforts across silicon design, floorplanning, PDN modeling, and mechanical/thermal reliability.
Lead package material selection, substrate stack-up definition, mechanical modeling, and reliability analysis.
Partner with silicon design teams to co-optimize die floorplan, bump map, TSV, and RDL requirements.
Work with OSATs / Foundry partners to evaluate process capability, manufacturability, yield, and cost.
Drive package qualification and reliability validation to volume readiness.

Requirements

What you’ll need

Experience in advanced package and substrate technologies with deep understanding of process and materials, component and board level reliability, warpage and thermal management.
Experience in managing substrate and assembly material vendors, substrate manufacturers, OSATs and foundries.
Deep knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as design methodology and strategies.
Experience in signal and power integrity simulations, analysis and optimization for 2.5D and 3D packages including interface with memory, interposer, substrates and PCBs.
Ability to determine optimal signal routing, power delivery verification and package size determination
Bachelor’s degree in mechanical engineering, material science or related fields and 20+ years of related professional experience or master’s degree and 15+ years of related professional experience or PhD degree / post-doc with 12+ years of experience.
Experience interfacing with product design teams for optimized floor-planning, package related design input and power delivery network design.

Benefits

Comp & perks

employee stock purchase plan with a 2-year look back
family support programs to help balance work and home life
robust mental health resources to prioritize emotional well-being
recognition and service awards to celebrate contributions and milestones

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

packaging technologysignal integritypower integritythermal designmechanical modelingreliability analysiscircuit extractiondesign methodology2.5D packages3D packages

Soft Skills

leadershipcollaborationcommunicationproblem-solvingproject management

Certifications

Bachelor’s degree in mechanical engineeringBachelor’s degree in material scienceMaster’s degreePhD degree