Kandou

Mechanical Engineer

• Complete all Package design activities within the given time frame as defined by the project deliverables.
• Complete Package design review processes with the Assembly subcons to ensure no design rule violations.
• Liaise closely with the respective IC layout Engineers during Package design phase.
• Complete verification of Electrical characteristics of the package and unit design using available SW Tools.
• Ensure cost effective methodologies are incorporated into Kandou’s BGA substrate and LF designs (Multi Layer / Mechanical Drill / Plating Lines etc).
• Provide support, guidance and instructions to Assembly / Package related activities, questions and issues.
• Present detailed weekly reports of activities and progress to the cross-functional team.
• Work with multi-functional groups including product design, engineering and marketing to ensure our package design/technology requirements are fully supported by Kandou’s assembly partners.

Package Design Engineer

Engineer

• Manage and maintain an integrated analog/digital EDA environment
• Flow development & automation: design, automate, and validate robust CAD flows
• Methodology support: provide expert guidance to analog and digital design engineers; troubleshoot tool issues
• Vendor management: serve as the primary technical contact with EDA vendors
• PDK installation & support: contribute to installation, qualification, and deployment of PDKs
• Continuous improvement: proactively identify bottlenecks and implement solutions

EDA / CAD Engineer

• Contribute as part of a responsive team to define and implement IC design tools, flows, and methodologies.
• Lead and support tool evaluation, selection, consensus-building, deployment, and flow development.
• Deliver training to engineering design teams.
• Work with EDA/CAD vendors to resolve tool issues and help design teams reach timely, practical solutions.
• Contribute to company-wide alignment on design tools, flows, and methodologies.

Digital EDA, CAD Engineer

Engineering Manager

• Define, architect, develop, and deliver the full software stack including validation software, embedded firmware, device drivers, system software, SDKs, application-level software, and customer support/demonstration tools
• Establish and continuously improve robust, scalable software development processes optimized for production environments
• Ensure predictable delivery of high-quality, well-documented, secure, and maintainable software releases that meet stringent reliability and performance standards
• Build, scale software capability aligned with company’s business strategy and product roadmap
• Engage with customers (internal/external) to understand goals, strategies, and technical needs - and lead the definition and execution of high-value and quality solutions

Director of Software Engineering

IT Support

• Designing SerDes and RF circuits
• Implementing precision LF DC circuits

Analog Circuit Engineer – Contractor

Systems Engineer

• Architectural performance simulations using application traces or synthetic workloads to quantify the effects of various memory subsystems
• FPGA prototyping of memory subsystems in the lab for functional and performance validation.
• Use of off shelf FPGA boards is acceptable.
• Analysis of configurations of memory controllers and their impact on computer system performance
• Participate in SoC architecture design and analysis particularly being responsible for memory controllers
• Assist the engineering team in formulating and executing design verification and validation plans around DRAM controller & memory

Memory Systems Engineer

• Position in design, modeling, and verification of custom analog designs for high-speed serdes transceivers in advanced technology nodes
• Design and verification of analog circuits, following prescribed design and documentation flows, to meet architecture specifications
• If necessary, support and interact with customers on requirements, design specifications, performance results and product delivery
• Support analog IP and chip level integration
• Collaborate with architects, technical leads, analog and digital design, layout, integration, verification, silicon validation and quality teams as needed

Analog Design Engineer

• Work with Kandou code technology developers and product teams to advise on SI solutions and issues for such codes and products
• Work with Kandou circuit designers and advise on SI solutions and issues for Kandou's silicon implementations
• Support Kandou staff in high speed signaling Standards (IEEE, OIF, memory) analysis and definitions
• Interact with Kandou customers and component suppliers on the development and analysis of hardware solutions
• Provide theoretical and simulation-based signal integrity analysis of Kandou products, test structures, and hardware solutions
• Prepare technical analysis reports for internal Kandou teams and external Kandou customers
• Evaluate the SI performance of Kandou Chord encoding systems in comparison with other systems such as PAM4, PAM8, etc
• Work with Kandou chip/circuit designers SI/PI/power solutions for package and evaluation boards
• Conduct SI/PI/power validation test and simulation to measurement correlation
• Create design specs, simulation reports, issue debug reports and validation test plan

Signal Integrity Engineer

• Position in custom layout and verification of analog circuits, cells, blocks, and IP for multi-Gigabit high speed chip to chip communication links (SerDes up to and beyond 28Gb/s and/or memory IO) in advanced semiconductor technology nodes
• Layout and verification of very high-speed analog circuits
• Interact closely with the design team to understand requirements and implement solutions
• Support IP and chip level integration
• Support and interact with customers on requirements, and IP delivery
• Exposure to flip-chip package technologies

Lead Analog Layout Engineer

• Authority in all stages of assembly manufacturing
• Promotion of Design for Manufacture (DFM) philosophy within Kandou Bus
• Ownership of package technology selection and design in accordance with Kandou products requirements
• Ownership of substrate design for substrate-based products e.g. TFBGA, LFBGA, FCCSP, etc.
• Transfer of product performance, quality, and customer requirements into various design and or assembly specifications/procedures
• Ownership of all packaging documentation/maintenance along with implementation of relevant specifications at Kandou’s packaging partners
• Bring up and management of assembly partners in line with Kandou’s product realization process ensuring qualification, early volume, and sustaining engineering
• Work with multi-functional groups including product design, engineering, and marketing to ensure our package technology requirements are fully supported by Kandou’s assembly partners.
• Review package technology offerings and Kandou’s product requirements driving understanding and alignment with Kandou’s technology roadmap
• Drive accountability and awareness, solve problems, remove roadblocks, and proactively search out and address risks or weaknesses to ensure new product requirements meet quality standards and NPI completes on time and within budget
• Provide silicon leadership driving initiatives including time to market, yield, quality & cost
• Specifies assembly/packaging partners
• Improves assembly production performance through monthly metrics, quarterly business reviews and comprehensive supplier assessments
• Prepares analysis presenting data analysis to management and customers where required
• Assures supplier understanding of production requirements
• Maintains required documentation and files

Packaging Engineer

• Define block- and top-level specifications for high-speed digital circuits that meet key performance targets based on system-level requirements
• Review and challenge architectural specifications to ensure robustness and efficiency
• Specify analog/digital interfaces in close collaboration with analog and mixed-signal design teams
• Design, implement, and test RTL code
• Collaborate closely with verification and physical implementation engineers to ensure functionality, timing, area, and power goals are met
• Support post-silicon activities, including lab bring-up, debugging, characterization, and productization
• Manage workload and schedules, providing regular updates to internal management and external customers

Digital Design Engineer

• Authority in silicon manufacturing
• Promote Design for Manufacture (DFM) philosophy within Kandou Bus
• Manage interface between Kandou and foundry partners in line with Kandou’s product realization process ensuring qualification, early volume, and sustaining engineering
• Work with multi-functional groups including product design, engineering, and marketing to ensure our silicon technology requirements are fully supported by Kandou’s silicon foundry partners
• Review silicon foundry technology offerings and Kandou’s product requirements driving understanding and alignment with Kandou’s technology roadmap
• Drive accountability and awareness, solve problems, remove roadblocks, and proactively search out and address risks or weaknesses to ensure new product requirements meet quality standards and NPI completes on time and within budget
• Provide silicon leadership driving initiatives including time to market, yield, quality & cost
• Specifies silicon foundry partners, and fab or fabs
• Improves silicon production performance through monthly metrics, quarterly business reviews and comprehensive supplier audits
• Prepares analysis presenting data analysis reports to management and customers where required
• Assures supplier understanding of production requirements
• Maintains required documentation and files