Senior ASIC Package Design Engineer

K2 Space Corporation

Senior ASIC Package Design Engineer for K2 Space developing advanced ASIC package architecture in a groundbreaking space startup.

Posted 4/13/2026full-timeRemote • 🇺🇸 United StatesSenior💰 $180,000 - $260,000 per yearWebsite

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
Establish package design standards, methodologies, and best practices.
Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.
Support package-level SI/PI strategy, including high-speed digital interfaces, power delivery network (PDN) design, and decoupling strategy
Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling.
Drive material selection, substrate technology choices, and assembly process optimization.

Requirements

What you’ll need

Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
5+ years of experience in ASIC package design, with deep expertise in FC-BGA.
Proven experience delivering high-pin-count, high-performance ASIC packages into production.
Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
Experience working directly with OSATs and substrate vendors.
Knowledge of packaging qualification and test methodologies.

Benefits

Comp & perks

Comprehensive benefits package including paid time off
Medical/dental/vision coverage
Life insurance
Paid parental leave
Equity in the company

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

ASIC package designFC-BGAhigh-speed SerDespower delivery network (PDN) designthermal managementsubstrate technologiessignal integrity (SI)power integrity (PI)decoupling strategymechanical interfaces

Soft Skills

leadershipcollaborationproblem-solvingcommunication