Principal Engineer, Hybrid Bonding Module

Intel Corporation

Principal Engineer for Die-to-Wafer Hybrid Bonding module at Intel, driving advanced semiconductor packaging technologies. Leading process development and collaboration for next-generation bonding architectures and capabilities.

Posted 6/2/2026full-timeHillsboro • Oregon • 🇺🇸 United StatesLead💰 $211,400 - $298,440 per yearWebsite

About the role

Key responsibilities & impact

Define and drive the hybrid bonding technology roadmap
Lead module-level process development and execution for die-to-wafer hybrid bonding
Drive first-of-a-kind (FOK) equipment and platform development
Develop and implement strategies to address critical hybrid bonding challenges
Partner with equipment vendors and materials suppliers to develop enabling technologies
Collaborate across technology development, process integration, and manufacturing teams
Identify future technology needs and drive cross-organizational and external collaboration
Mentor and develop technical leaders and domain experts
Align technical strategies with organizational goals

Requirements

What you’ll need

Bachelor's degree + 15+ years of experience, or Master's degree + 10+ years of experience, or PhD + 8+ years of experience
Deep expertise in hybrid bonding, wafer bonding, or advanced packaging module development
Proven industry experience in hybrid bonding equipment development and process development
Process optimization, yield improvement, and reliability enhancement
First-of-a-kind (FOK) platform or equipment development and scaling to high-volume manufacturing (HVM)
Excellent communication and decision-making skills, with the ability to align technical vision with organizational and product goals.

Benefits

Comp & perks

Competitive pay
Stock bonuses
Health
Retirement
Vacation

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

hybrid bondingwafer bondingadvanced packaging module developmentprocess optimizationyield improvementreliability enhancementfirst-of-a-kind (FOK) platform developmenthigh-volume manufacturing (HVM)equipment developmentprocess development

Soft Skills

communication skillsdecision-making skillsmentoringcollaborationleadershipstrategic alignment

Certifications

Bachelor's degreeMaster's degreePhD