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Intel Corporation

Module Development Engineer

Intel Corporation

Module Development Engineer at Intel driving technology development for semiconductor manufacturing and high volume manufacturing process enablement. Leading design and development of advanced manufacturing processes.

Posted 5/29/2026full-timeHillsboro • Arizona, California, Oregon, Texas • 🇺🇸 United StatesSeniorLead💰 $211,400 - $298,440 per yearWebsite

About the role

Key responsibilities & impact
  • Drives technology development and enablement for both high volume manufacturing and future technology
  • Provides process integration and equipment solutions
  • Performs feasibility studies to meet desired device specifications
  • Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements
  • Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures
  • Develops roadmaps for technologies enabling future roadmap
  • Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products
  • Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology
  • Remains updated on relevant industrial process and material manufacturing technical trends

Requirements

What you’ll need
  • PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field
  • Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures
  • Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems
  • Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority.
  • Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies
  • Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions
  • Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations
  • Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation.

Benefits

Comp & perks
  • competitive pay
  • stock bonuses
  • health
  • retirement
  • vacation

ATS Keywords

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Hard Skills & Tools
plasma physicsdata analyticsstatistical modelingdesign of experimentsdry etch solutionsadvanced etch technologiesHigh aspect ratio plasma etchAtomic Layer EtchEUV patterned layer etchdevice characterization
Soft Skills
leadershipinfluencecollaborationproblem-solving
Certifications
PhD in Chemical EngineeringMaster's degree in STEM field