Product Engineering Graduate Intern

Intel Corporation

Support the development of assembly design rules for advanced silicon packaging and assist in validation of silicon products at Intel. Collaborate with cross-functional teams to optimize product performance.

Posted 5/27/2026internshipHillsboro • Arizona, Oregon • 🇺🇸 United StatesEntry Level💰 $89,200 - $120,700 per yearWebsite

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Support development and maintenance of assembly design rules that address capabilities and constraints of advanced silicon packaging and heterogeneous integration.
Contribute to package assembly design kit by creating and evaluating test cases for different assembly configurations.
Evaluate constraints arising from multidie integration, ensuring compliance with documented assembly rules.
Interpret design rule impacts on manufacturability, yield, and system-level integration requirements.
Assist in reviewing bump layouts and propose corrections across a design life cycle.
Prepare reports summarizing rule checks, violations, and recommendations.

Requirements

What you’ll need

Currently pursuing a Masters or PhD in Electrical Engineering, Computer Engineering, or a related field with a focus on semiconductor devices or silicon testing.
3+ months experience with packaging assembly design.
Experience with root cause analysis and problem-solving in a technical environment.
Familiarity with technical documentation and communication of engineering results.
Demonstrated ability to collaborate effectively with cross-functional teams in a research or engineering environment.
Knowledge of design for debug (DFD) principles and their applications in silicon validation.
Strong interest in continuous learning and improvement within the semiconductor domain.
Passion for making meaningful contributions to innovative technologies and products.

Benefits

Comp & perks

competitive pay
stock bonuses
benefit programs which include health, retirement, and vacation

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

assembly design rulesmultidie integrationtest case creationmanufacturability evaluationyield analysisbump layout reviewroot cause analysisproblem-solvingdesign for debug (DFD)silicon validation

Soft Skills

collaborationcommunicationcontinuous learningproblem-solvingtechnical documentation

Certifications

Masters in Electrical EngineeringPhD in Electrical EngineeringMasters in Computer EngineeringPhD in Computer Engineering