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Senior Process Engineer – Dry Etch
Intel CorporationSenior Process Engineer focusing on integration and device engineering across multiple technologies at Intel. Serve global foundry customers with advanced manufacturing processes.
Posted 5/19/2026full-timeHillsboro • Arizona, Oregon • 🇺🇸 United StatesSenior💰 $155,520 - $298,440 per yearWebsite
About the role
Key responsibilities & impact- Drive technology development initiatives that enable both high-volume manufacturing and future technology advancement
- Provide comprehensive process integration and equipment solutions
- Conduct feasibility studies to meet target device specifications
- Lead design and development of sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design
- Optimize production output for existing products
- Partner with key equipment and materials suppliers to develop enabling technology elements
- Perform process technology feasibility studies using theoretical simulations and practical engineering methods
- Stay current with industrial process and material manufacturing trends
- Develop insights into future Intel process technology needs
- Partner with vendor ecosystem to build cost-sensitive technology roadmaps
- Influence and drive technical direction across Intel and the broader industry
- Develop and mentor technical leaders within the organization
Requirements
What you’ll need- Bachelor's degree in Electrical Engineering, Physics, Material Science, or in a STEM related field of study
- 7+ years of hands-on experience in CMOS device engineering, device physics, logic architecture, and interconnect development on leading-edge nodes
- Direct etch experience in advanced CMOS device technology
- Knowledge of Design of Experiment (DOE) principles and engineering data analysis tools
- Semiconductor foundry experience
- Advanced degree (MS/PhD) in Electrical Engineering, Physics, Material Science, or in a STEM related field of study (preferred)
- Hands-on experience with sub-3nm Gate-All-Around (GAA) FETs (preferred)
- Experience in ramp and high-volume manufacturing environments (preferred)
- Experience with industry standards and certifications (preferred)
- Experience with device parametric data generation and analysis (preferred)
- Demonstrated success in foundry New Product Introduction (NPI) activities and complex tape-out troubleshooting (preferred)
- Experience in product data interpretation, root cause analysis, and solution development (preferred)
Benefits
Comp & perks- Competitive pay
- Stock bonuses
- Health insurance
- Retirement plans
- Vacation
ATS Keywords
✓ Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
CMOS device engineeringdevice physicslogic architectureinterconnect developmentetch experienceDesign of Experiment (DOE)engineering data analysissub-3nm Gate-All-Around (GAA) FETsNew Product Introduction (NPI)root cause analysis
Soft Skills
leadershipmentoringinfluencecollaboration