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Intel Corporation

Senior Process Engineer – Dry Etch

Intel Corporation

Senior Process Engineer focusing on integration and device engineering across multiple technologies at Intel. Serve global foundry customers with advanced manufacturing processes.

Posted 5/19/2026full-timeHillsboro • Arizona, Oregon • 🇺🇸 United StatesSenior💰 $155,520 - $298,440 per yearWebsite

About the role

Key responsibilities & impact
  • Drive technology development initiatives that enable both high-volume manufacturing and future technology advancement
  • Provide comprehensive process integration and equipment solutions
  • Conduct feasibility studies to meet target device specifications
  • Lead design and development of sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design
  • Optimize production output for existing products
  • Partner with key equipment and materials suppliers to develop enabling technology elements
  • Perform process technology feasibility studies using theoretical simulations and practical engineering methods
  • Stay current with industrial process and material manufacturing trends
  • Develop insights into future Intel process technology needs
  • Partner with vendor ecosystem to build cost-sensitive technology roadmaps
  • Influence and drive technical direction across Intel and the broader industry
  • Develop and mentor technical leaders within the organization

Requirements

What you’ll need
  • Bachelor's degree in Electrical Engineering, Physics, Material Science, or in a STEM related field of study
  • 7+ years of hands-on experience in CMOS device engineering, device physics, logic architecture, and interconnect development on leading-edge nodes
  • Direct etch experience in advanced CMOS device technology
  • Knowledge of Design of Experiment (DOE) principles and engineering data analysis tools
  • Semiconductor foundry experience
  • Advanced degree (MS/PhD) in Electrical Engineering, Physics, Material Science, or in a STEM related field of study (preferred)
  • Hands-on experience with sub-3nm Gate-All-Around (GAA) FETs (preferred)
  • Experience in ramp and high-volume manufacturing environments (preferred)
  • Experience with industry standards and certifications (preferred)
  • Experience with device parametric data generation and analysis (preferred)
  • Demonstrated success in foundry New Product Introduction (NPI) activities and complex tape-out troubleshooting (preferred)
  • Experience in product data interpretation, root cause analysis, and solution development (preferred)

Benefits

Comp & perks
  • Competitive pay
  • Stock bonuses
  • Health insurance
  • Retirement plans
  • Vacation

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools
CMOS device engineeringdevice physicslogic architectureinterconnect developmentetch experienceDesign of Experiment (DOE)engineering data analysissub-3nm Gate-All-Around (GAA) FETsNew Product Introduction (NPI)root cause analysis
Soft Skills
leadershipmentoringinfluencecollaboration