Senior Substrate Program Manager

Intel Corporation

Senior Substrate Program Manager at Intel focusing on advanced packaging development for AI devices. Collaborating with suppliers and leading qualification efforts in substrate manufacturing.

Posted 5/11/2026full-timeTaipei • 🇹🇼 TaiwanSeniorWebsite

About the role

Key responsibilities & impact

Work at the forefront of packaging technologies essential for next-generation AI devices
Collaborate with substrate suppliers worldwide to drive innovation and scalability
Contribute to the deployment of EMIB-T, our next-generation advanced packaging substrate technology
Lead efforts to qualify new capacity at advanced packaging suppliers, ensuring timely readiness to meet growing customer demand
Collaborate closely with on-site supplier engineering teams and the US integration team to advance substrate building block technologies
Monitor, optimize, and improve capacity in bottleneck processes by implementing strategies that reduce throughput time (TPT)
Oversee schedules for product and test vehicle (TV) deliveries, proactively resolving issues to achieve aggressive on-time delivery (OTD) targets
Conduct thorough analysis of substrate lead times, develop reduction roadmaps, and consistently meet quarterly lead time goals
Ensure strict adherence to Process Control System (PCS) commitments by suppliers
Partner with internal teams to design and execute new factory TV/product certification plans focused on yield improvement
Develop and maintain detailed micro-schedules for new factory startups, including milestone tracking to ensure supplier compliance with startup timelines
Lead qualification activities and monitor ramp indicators to guarantee smooth, incident-free production ramp-up of new capacity
Influence strategic decision-making at supplier management levels

Requirements

What you’ll need

Bachelor's or Master's degree with 8+ years, or PhD with 4+ years work experience, in Science or Engineering
6+ years of experience in fab back-end or substrate manufacturing process development
Experience in capacity management, lead time analysis, structured problem solving, situational leadership, supplier influence, and stakeholder management
Strong understanding of substrate process building blocks such as component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection/metrology, and electrical testing
Experience qualifying /owning process tools in a TD/ramp or HVM context is desired
Hands-on experience in factory operations, substrates, manufacturing, process engineering, and yield improvement is highly preferred
Fluent business-level English communication skills, excellent presentation abilities, and capability to engage effectively with supplier management.

Benefits

Comp & perks

Regular travel to supplier sites
Onsite presence at factories (minimum three days per week)
Collaboration with diverse teams across Asia and the US
Flexibility to adapt to evolving project scopes and dynamic business needs

ATS Keywords

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Hard Skills & Tools

packaging technologiessubstrate manufacturingcapacity managementlead time analysiscomponent embeddinglaser drillingdielectric laminationlithographymulti-metal electrolytic platingdefect inspection

Soft Skills

situational leadershipstakeholder managementproblem solvingcommunicationpresentationcollaborationinfluencestrategic decision-makingorganizational skillsproactive issue resolution

Certifications

Bachelor's degreeMaster's degreePhD