Senior Thermal Solutions Architect – Client Platforms

Intel Corporation

Senior Thermal Solutions Architect influencing system‑level thermal architectures for Intel's client platforms. Leading end‑to‑end thermal solution co‑engineering with OEM customers across desktops and notebooks.

Posted 5/1/2026full-timeHillsboro • California, Oregon • 🇺🇸 United StatesSenior💰 $164,470 - $269,100 per yearWebsite

About the role

Key responsibilities & impact

Own and drive thermal architecture end‑to‑end, translating advanced silicon capabilities into practical, production‑ready system solutions
Lead thermal architecture definition and execution across the full product lifecycle from early concept exploration through production and HVM
Co‑design innovative cooling solutions with top OEM partners, directly influencing high‑volume consumer and commercial PC products
Define power and temperature constraints based on real system cooling capabilities, and deliver clear guidance to product, platform, and manufacturing teams with a portfolio of thermal solutions
Perform thermal analysis, modeling, and validation for air‑ and liquid‑cooled systems across notebooks, desktops, and emerging form factors
Apply deep expertise in heat transfer fundamentals conduction, convection (active and passive), and radiation to guide design tradeoffs for high density form factors
Characterize and validate cooling technologies, including heat sinks, fans, heat pipes, vapor chambers, cold plates, and TIMs
Develop and correlate multi‑scale thermal models spanning silicon, package, PCB, and full system levels
Tune system‑level thermal management, integrating mechanical design, firmware‑based thermal policies, and platform controls
Deliver technical leadership and design reviews in collaboration with pre‑silicon, post‑silicon, and validation teams
Partner closely with power, mechanical, electrical, reliability, and manufacturing teams to solve complex, cross‑disciplinary challenges
Drive continuous innovation through experimentation, prototyping, research, and data‑driven analysis

Requirements

What you’ll need

Bachelor's degree in Mechanical Engineering or a STEM-related field, with 7+ years of experience solving thermal and mechanical challenges in the electronics industry, or a Master's degree in the same fields with 5+ years of relevant experience
5+ years of hands on experience in Computational Fluid Dynamics (CFD) tools, such as IcePak, FloTHERM, or ANSYS Fluent
5+ years of technical expertise in thermal components, including cold plates, heat sinks, fans, heat pipes, vapor chambers, and TIMs
Advanced experience designing and optimizing thermal solutions for client systems across multiple form factors
Experience with statistical analysis methods and statistical software tools
Experience with scripting or automation related to thermal tools or workflows
Ability to communicate complex technical concepts effectively to both technical and non‑technical audiences.

Benefits

Comp & perks

competitive pay
stock bonuses
health
retirement
vacation

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

thermal architecturethermal analysisheat transferComputational Fluid Dynamics (CFD)thermal componentsthermal modelingthermal managementstatistical analysisscriptingautomation

Soft Skills

technical leadershipcommunicationcollaborationproblem-solvinginnovation