Silicon Packaging Design Engineer

Intel Corporation

Silicon Packaging Design Engineer driving end-to-end silicon packaging substrate development for Intel. Collaborating with teams to optimize silicon package board performance and pinout.

Posted 5/1/2026full-timePhoenix • Arizona, Oregon • 🇺🇸 United StatesMid-LevelSenior💰 $141,910 - $200,340 per yearWebsite

Tech Stack

Tools & technologies

Python

About the role

Key responsibilities & impact

Drive end-to-end development for silicon packaging substrate design from concept through tapeout
Perform substrate fit and routing studies to assess design, performance, and cost tradeoffs
Implement physical layout and routing of package designs, ensuring adherence to design rules
Optimize silicon-package-board performance and pinout by working closely with silicon and hardware teams
Define substrate design rules and conduct internal and external design reviews
Analyze data and resolve design rule checks (DRCs) to refine package designs
Develop comprehensive documentation and collateral, storing them in the product lifecycle management system of record

Requirements

What you’ll need

Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics with 4+ years of experience
Or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics with 3+ years of experience
Or Phd degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics
Experience with Package or board design and review tools like Siemens Xpedition, Cadence Allegro Package Design, Valor NPI, AutoCAD, or SolidWorks
Expertise in Package Design and Development, interconnect methodologies, and/or manufacturability principles
Familiarity with microelectronic package electrical modeling and simulation tools such as PowerDC, HyperLynx, Q3D, and HFSS
Experience with scripting using Python, VB, C, or similar languages

Benefits

Comp & perks

competitive pay
stock bonuses
health insurance
retirement plans
vacation

ATS Keywords

✓ Tailor your resume

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

silicon packaging substrate designsubstrate fit and routing studiesphysical layout and routingdesign rule checks (DRCs)package design and developmentinterconnect methodologiesmanufacturability principlesscriptingPythonC

Certifications

Bachelor's degree in Electrical EngineeringBachelor's degree in Mechanical EngineeringBachelor's degree in Materials ScienceBachelor's degree in PhysicsMaster's degree in Electrical EngineeringMaster's degree in Mechanical EngineeringMaster's degree in Materials ScienceMaster's degree in PhysicsPhD in Electrical EngineeringPhD in Mechanical Engineering