Senior Technical Solutions Engineer – Advanced Packaging

Intel Corporation

. Serve as the primary customer interface, building trust and ensuring seamless communication throughout all engagement phases .

Posted 4/22/2026full-timePhoenix • Arizona, California, Oregon, Texas • 🇺🇸 United StatesSenior💰 $160,980 - $311,040 per yearWebsite

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Serve as the primary customer interface, building trust and ensuring seamless communication throughout all engagement phases
Act as the Voice of the Customer within Intel Foundry, advocating for customer priorities and expectations across all internal functions
Partner directly with customers to understand packaging challenges and requirements
Provide expert technical consultation on packaging solutions and processes
Connect customers with Intel Foundry's technical experts for specialized insights
Work with Technology Development, Product Engineering, Manufacturing, Operations, and Customer Engineering teams
Influence product and technology roadmaps through customer feedback and market insights
Coordinate internal Intel resources to ensure customer success
Develop and maintain comprehensive Statements of Work (SOW) documenting requirements, commitments, deliverables, and milestones
Manage complete customer engagement lifecycle from design award through high-volume manufacturing and end-of-life
Track commitments, action items, and escalations while monitoring risks and dependencies
Drive resolution of qualification and delivery issues
Provide clear, regular status reports to customers and leadership
Facilitate effective communication between technical and business stakeholders

Requirements

What you’ll need

Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or in a related field
5+ years of experience in Semiconductor Packaging, Assembly/Test, Backend Manufacturing, Operations, Product Engineering, Field Applications, or customer-facing engineering roles
8+ years of Semiconductor experience
Post graduate degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field (preferred)
Experience in Advanced Packaging Technologies including 2.5D/3D, Chiplets, HBM, HSIO, SiP, Power Delivery, and Thermal Management (preferred)
Experience with Advanced Package Manufacturing, Bumping, Assembly, and Test processes (preferred)
Experience with DOE, FMEA, yield analysis, and failure analysis methodologies (preferred)
Project management and customer-facing experience (preferred)
Flexibility for travel as needed (preferred)

Benefits

Comp & perks

Competitive pay
Stock bonuses
Health insurance
Retirement plans
Vacation

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

Semiconductor PackagingAssembly/TestBackend ManufacturingOperationsProduct EngineeringAdvanced Packaging Technologies2.5D/3DChipletsHBMThermal Management

Soft Skills

customer interfacecommunicationadvocacytechnical consultationstakeholder facilitationproject managementcustomer engagementproblem resolutionstatus reportingrisk monitoring

Certifications

Bachelor's degreePost graduate degree