Packaging Design Architect

Intel Corporation

ADCE Packaging Design Architect at Intel working with design teams to optimize product performance. Collaborating on advanced packaging technologies and leading substrate design.

Posted 4/15/2026full-timePhoenix • Arizona, Oregon • 🇺🇸 United StatesSeniorLead💰 $256,050 - $361,480 per yearWebsite

About the role

Key responsibilities & impact

Drives end-to-end development for substrate design from concept through tapeout and implements physical layout and routing of the package design
Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs
Works closely with silicon and hardware teams to optimize silicon package board performance and pinout
Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design
Completes documentation and collateral into the product lifecycle management system of record

Requirements

What you’ll need

Ph.D. or Master’s in electrical engineering, chemical engineering, mechanical engineering, or material science
10+ years of in-depth knowledge/background in Package, PCB design, or IC digital design
Strong technical background in design and electrical analysis
Solid background in semiconductor fabrication and packaging
Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.
Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx)
Strong analytical ability and problem-solving skills
Ability to work independently and at various levels of abstraction
Strong organization, time management, and communication skills, self-motivated

Benefits

Comp & perks

Competitive pay
Stock bonuses
Health insurance
Retirement plans
Vacation

ATS Keywords

✓ Tailor your resume

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

substrate designPCB designIC digital designelectrical analysissemiconductor fabricationpackagingdesign rulesrouting studiesdata analysisDRC resolution

Soft Skills

analytical abilityproblem-solving skillsindependenceorganizationtime managementcommunication skillsself-motivation

Certifications

Ph.D. in electrical engineeringMaster’s in electrical engineeringPh.D. in chemical engineeringMaster’s in chemical engineeringPh.D. in mechanical engineeringMaster’s in mechanical engineeringPh.D. in material scienceMaster’s in material science