Packaging Design Architect
Intel Corporation
full-time
Posted on:
Location Type: Hybrid
Location: Phoenix • Arizona • Oregon • United States
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Salary
💰 $256,050 - $361,480 per year
About the role
- Drives end-to-end development for substrate design from concept through tapeout and implements physical layout and routing of the package design
- Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs
- Works closely with silicon and hardware teams to optimize silicon package board performance and pinout
- Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design
- Completes documentation and collateral into the product lifecycle management system of record
Requirements
- Ph.D. or Master’s in electrical engineering, chemical engineering, mechanical engineering, or material science
- 10+ years of in-depth knowledge/background in Package, PCB design, or IC digital design
- Strong technical background in design and electrical analysis
- Solid background in semiconductor fabrication and packaging
- Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.
- Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx)
- Strong analytical ability and problem-solving skills
- Ability to work independently and at various levels of abstraction
- Strong organization, time management, and communication skills, self-motivated
Benefits
- Competitive pay
- Stock bonuses
- Health insurance
- Retirement plans
- Vacation
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
substrate designPCB designIC digital designelectrical analysissemiconductor fabricationpackagingdesign rulesrouting studiesdata analysisDRC resolution
Soft Skills
analytical abilityproblem-solving skillsindependenceorganizationtime managementcommunication skillsself-motivation
Certifications
Ph.D. in electrical engineeringMaster’s in electrical engineeringPh.D. in chemical engineeringMaster’s in chemical engineeringPh.D. in mechanical engineeringMaster’s in mechanical engineeringPh.D. in material scienceMaster’s in material science