Adapt, develop, deploy and sustain yield analysis software solutions
Drive aspects of Advanced Packaging's inline defect data pipeline workflows
Work closely with partners from automation, metrology, yield/defmet and manufacturing on requirements, enabling, testing and debugging
Contribute to system integration projects for enhancing advanced packaging capabilities in Klarity / Exensio / custom solutions
Lead enabling / debugging projects, role modeling effective problem solving
Demonstrate a strong sense of ownership and quality to drive for mutually effective solutions

Requirements

Possess a Bachelor's Degree in Engineering, Computer Science, Data Science, Information Systems, Chemistry, Physics, Materials Science or any related technical discipline with 3+ years of relevant experience -OR- Master's degree with 2+ years -OR- PhD degree with 1+ year
Experience in Python or comparable programming language
Strong problem-solving and teamwork skills
Experience with Intel's wafer defect metrology and analysis ecosystem
Previous related work experience in a semiconductor foundry (preferred)
Experience with Industry standard Defect and Yield Analysis applications like Klarity or Exensio
Yield improvement or defect metrology / defect reduction experience
Experience with ADC (Automated Defect Classification) and Machine Learning / AI
Experience with modern distributed version control systems, particularly Git, GitLab, or GitHub

Benefits

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

PythonAutomated Defect ClassificationMachine LearningAIdefect metrologyyield analysisdefect reductionsystem integrationversion controlGit

Soft Skills

problem-solvingteamworkownershipquality focus