Engineer

• Lead technical engagement with OSAT suppliers on assembly and test process development, yield ramp, quality improvement, and volume manufacturing readiness.
• Drive new product introduction (NPI) from engineering builds through production release, ensuring OSAT capability meets electrical/thermal/mechanical requirements for FPGA and SoC products.
• Optimize packaging and test architectures for performance, cost, and reliability: flip-chip BGA, high-pin-count packages, substrate technologies, wafer-level solutions, burn-in/FT coverage.
• Monitor and improve backend yield performance using data-driven analysis; identify systemic issues and lead root cause / corrective actions.
• Partner with Test Engineering, Packaging, Product Engineering, DFM, and Quality teams on process optimization, failure analysis, and manufacturability improvements.
• Implement and maintain process control systems, SPC methodologies, automation improvements, and lean manufacturing principles at OSAT.
• Support cost reduction initiatives including BOM optimization, process simplification, and cycle time improvements.
• Track supplier performance metrics (yield, DPPM, cost, cycle time, OEE) and provide updates with risk assessments and mitigation plans.
• Lead or support reliability testing and package qualification activities aligned to industry standards (JEDEC, IPC, AEC-Q).
• Maintain strong technical relationship and communication cadence with OSAT partners to ensure transparency, collaboration, and escalation management.

Senior OSAT Engineer

Managed Services Engineer

ICT Project Engineer