Package Architecture Analyst

Intel Corporation

Silicon packaging architect developing semiconductor package architectures for Intel's advanced semiconductor products. Driving design-to-production readiness across silicon, hardware, and manufacturing teams.

Posted 9/4/2026full-timeHillsboro • Arizona, Oregon • 🇺🇸 United StatesSeniorLead💰 $190,610 - $269,100 per yearWebsite

Core Competencies

Role fit

Core Competencies

Use this summary to align your resume positioning with the role.

Demonstrates expertise in semiconductor packaging technologies and Design for Manufacturing principles, with a strong focus on delivering innovative packaging solutions and optimizing production efficiency. Proven ability to lead cross-disciplinary teams and troubleshoot complex design and manufacturing issues.

Highest-signal resume keywords

Semiconductor Packaging ArchitectureDesign for Manufacturing (DFM)Design of Experiments (DOE)Technical Documentation DevelopmentCross-Disciplinary Team Leadership

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Mechanical EngineeringElectrical EngineeringMaterials SciencePackaging DevelopmentTroubleshooting Package DesignContinuous ImprovementCost-Effective Packaging SolutionsManufacturing TransitionTechnical DocumentationAnalytical Problem-Solving

Soft Skills

Excellent CommunicationCollaborationAnalytical Skills

Industry Keywords

Semiconductor Packaging TechnologiesManufacturing EfficiencyTechnical EnvironmentIndustry TrendsCross-Functional Collaboration

About the role

Key responsibilities & impact

Translate product requirements into detailed package architecture specifications
Lead technology trade-off decisions across electrical, mechanical, thermal, and reliability requirements
Collaborate with silicon, hardware, and package leads to deliver package outputs and address roadblocks
Oversee packaging development, including designs, processes, and procedures
Drive continuous improvement in packaging quality standards
Troubleshoot package designs and resolve technical issues
Deliver innovative, cost-effective packaging solutions
Partner with manufacturing teams on design-to-production transitions and tape-out readiness
Apply Design for Manufacturing principles to optimize manufacturability and production efficiency
Maintain and refine technical documentation for package development processes

Requirements

What you’ll need

Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field with 9+ years of hands-on experience, OR a Master's degree in a relevant field with 6+ years of hands-on experience, OR a PhD in a relevant field with 4+ years of hands-on experience
4+ years of experience defining semiconductor/electronic package architectures and developing technical documentation
Experience applying Design for Manufacturing (DFM) principles
Experience utilizing Design of Experiments (DOE) methodologies
Experience troubleshooting package design and manufacturing issues
Advanced understanding of semiconductor packaging technologies and industry trends
Experience leading cross-disciplinary teams in a technical environment
Excellent analytical, communication, and problem-solving skills
Ability to collaborate cross-functionally with silicon, hardware, and manufacturing teams

Benefits

Comp & perks

Competitive pay
Stock bonuses
Health benefits
Retirement benefits
Vacation benefits
Hybrid work model allowing employees to split time between on-site and off-site work