Advanced Packaging Cryogenic Modeling Engineer

GlobalFoundries

Cryogenic Modeling Engineer supporting semiconductor R&D using multi-physics tools for optimal device performance. Requires strong modeling experience in mechanical, thermal, and electrical areas.

Posted 5/12/2026full-timeSanta Clara • California, Vermont • 🇺🇸 United StatesSeniorLead💰 $118,000 - $239,000 per yearWebsite

About the role

Key responsibilities & impact

Support cryogenic packaging and system co-optimization R&D using commercial multi-physics tools
Develop and correlate cryogenic thermal, mechanical, and/or electrical models for semiconductor devices and advanced packages
Anticipate integration/process issues based on information from integration, process or design enablement teams

Requirements

What you’ll need

M.S. + minimum of 10 years of relevant experience
Semiconductor mechanical, thermal, and/or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software
Strong problem solving and technical troubleshooting skills including expertise in design of experiment
Must have at least an overall 3.0 GPA and proven good academic standing
Language Fluency - English (Written & Verbal)
Solid understanding of semiconductor processes and integration techniques
Good computer/software skills
Ability to clearly present results to small and large groups
Travel - Up to 10%

Benefits

Comp & perks

Health insurance
401(k) retirement plan
Paid time off
Professional development opportunities

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

cryogenic packagingthermal modelingmechanical modelingelectrical modelingdesign of experimentproblem solvingtechnical troubleshooting

Soft Skills

communicationpresentation skills

Certifications

M.S.