MTS 3D Heterogeneous Integration Engineer

GlobalFoundries

R&D Engineer at GlobalFoundries driving advanced 3D Heterogeneous Integration initiatives. Leading process development for advanced packaging solutions in semiconductor industry.

Posted 4/28/2026full-timeEssex Junction • Vermont • 🇺🇸 United StatesMid-LevelSenior💰 $98,000 - $176,000 per yearWebsite

About the role

Key responsibilities & impact

Drive 3D-HI process development efforts for advanced packaging solutions
Collaborate with engineers and vendors on projects
Develop expertise in processes, materials, and tooling
Drive data analysis and resolve process integration issues
Mentor and guide new hires

Requirements

What you’ll need

Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field
5-6 years of prior related work experience
In depth knowledge of BEOL processes and integration (advanced bonding, TSVs)
Strong problem solving and technical trouble shooting skills
Overall 3.0 GPA and proven good academic standing
Fluency in English (Written & Verbal)

Benefits

Comp & perks

Health insurance
Retirement plans
Paid time off
Flexible work arrangements
Professional development

ATS Keywords

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Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

3D-HI process developmentBEOL processesadvanced bondingTSVsdata analysisprocess integrationmaterials expertisetooling expertisetechnical troubleshootingproblem solving

Soft Skills

mentoringcollaborationguidancecommunication

Certifications

Master’s in Electrical EngineeringMaster’s in Mechanical EngineeringMaster’s in Chemical EngineeringMaster’s in Materials Science