Senior Fellow/VP, Technology Architecture, SiPh Packaging
GlobalFoundries
full-time
Posted on:
Location Type: Office
Location: Santa Clara • California • 🇺🇸 United States
Visit company websiteSalary
💰 $214,200 - $406,500 per year
Job Level
Senior
About the role
- Hands on GF technical subject matter expert for SiPhotonics packaging responsible to answer internal and external questions and to build GF capability in this area through shared knowledge training and recruitment efforts
- Provides leadership and training of engineers in product packaging design reviews, materials selection and FMEAs of customer packaging concepts
- Protects clients by ensuring that the maturity of a given technology, technology models, packaged design rules, and IP, meets industry expectations
- Ensures that all new technologies and features meet a standardized set of quality expectations tied to implementation into application representative packages for Data Centers, Automotive and Communications.
- Driving GF leadership in global SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
- Provides tools and complex analysis of quality issues and associated financial implications
- Protects the business by ensuring that all necessary requirements are met and that a technology performs to the expectations of a given customer or market to avoid costly re-designs
- Ensures standardization of site-based quality processes are executed appropriately
- Drives increased discipline and qualification robustness through a consistent global qualification process
- Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
Requirements
- MS, or PhD + 20 or more years of experience
- Expertise in photonic and electronic package architecture definition
- Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.
- Experience in bringing packaged products from development into production for data centers, automotive and communications
- Expert in chip package interaction for 2D, 2.5D, 3D SiPh advanced packaging
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
SiPhotonics packagingproduct packaging designmaterials selectionFMEAsquality analysischip package interaction2D packaging2.5D packaging3D packagingadvanced packaging
Soft skills
leadershiptrainingcommunicationproblem-solvingorganizational skillsdisciplinecollaborationanalytical skillsattention to detailsafety awareness
Certifications
MSPhD