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Principal Hardware Architect – Platform Architecture
General Motors
full-time
Posted on:
Location Type: Hybrid
Location: Mountain View • California, Missouri • 🇺🇸 United States
Visit company websiteSalary
💰 $228,900 - $350,500 per year
Job Level
Lead
About the role
- Define and evolve GM’s zonal hardware architecture, balancing performance, cost, scalability, and reliability.
- Lead tradeoff analysis across compute partitioning, networking, harnessing, and ECU design.
- Translate semiconductor technology roadmaps into platform-level hardware requirements.
- Define physical layer network topology and constraints for in-vehicle communication (Ethernet, CAN, LIN, PCIe, etc.).
- Decompose system-level requirements into ECU- and harness-level specifications.
- Collaborate with software architects to align hardware and software partitioning on microprocessors.
- Define ECU hardware design requirements, including power, thermal, and signal integrity considerations.
- Provide guidance on high-speed PCB design and layout best practices.
- Ensure manufacturability, reliability, and compliance with automotive standards.
- Partner with vehicle architecture, system architecture, software, and semiconductor teams to ensure cohesive system design.
- Serve as a technical authority and mentor for hardware engineering teams.
- Influence supplier and technology partner roadmaps to align with GM’s long-term strategy.
- Drive adoption of new technologies, tools, and methodologies in hardware architecture.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
- 12+ years of experience in hardware/system architecture, with significant experience in automotive or other high-reliability industries.
- Proven track record of defining and delivering complex hardware architectures at scale.
- Deep understanding of zonal architectures and vehicle E/E tradeoffs.
- Strong knowledge of software partitioning on microprocessors and its hardware implications.
- Expertise in physical layer network topology (Ethernet, CAN, LIN, PCIe, SerDes) and constraints.
- Ability to map semiconductor technology capabilities to physical layer and harness requirements.
- Strong background in high-speed PCB design and layout.
- Thorough understanding of vehicle architectures and tradeoff analysis.
- Ability to influence cross-functional teams and drive alignment across hardware, software, and vehicle architecture.
- Strong communication skills for engaging with technical and executive stakeholders.
- Experience mentoring and guiding engineering teams.
Benefits
- medical
- dental
- vision
- Health Savings Account
- Flexible Spending Accounts
- retirement savings plan
- sickness and accident benefits
- life insurance
- paid vacation & holidays
- tuition assistance programs
- employee assistance program
- GM vehicle discounts and more.
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
hardware architectureECU designhigh-speed PCB designphysical layer network topologyEthernetCANLINPCIeSerDessemiconductor technology
Soft skills
leadershipmentoringcommunicationcollaborationinfluencetradeoff analysisguidancealignmentproblem-solvingstakeholder engagement
Certifications
Bachelor’s degree in Electrical EngineeringMaster’s degree in Electrical EngineeringBachelor’s degree in Computer EngineeringMaster’s degree in Computer Engineering
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