Applications Engineer

Element Solutions Inc

Serve as primary technical bridge between R&D laboratory and global customers. Responsible for characterizing plating chemistries and ensuring high volume manufacturing readiness.

Posted 7/11/2026full-timeHsinchu • 🇹🇼 TaiwanMid-LevelSeniorWebsite

Core Competencies

Role fit

Core Competencies

Use this summary to align your resume positioning with the role.

Demonstrates expertise in electrochemical analysis and data package generation, with a strong focus on process optimization and technical documentation. Proven ability to lead metrology efforts and provide customer consultation in the electroplating and surface finishing industries.

Highest-signal resume keywords

Electrochemical AnalysisData Package GenerationMetrology LeadershipTechnical Report AuthoringExperimental Design

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Cyclic Voltammetric StrippingHull Cell AnalysisPotentiostatic TechniquesSEM/EDXXRF3D ProfilerProcess Window MappingBath Life StudiesStatisticsSix Sigma

Soft Skills

Strong Communication SkillsTeam PlayerProblem Solving

Tools & Technologies

SOPsBest Known Methods

Industry Keywords

ElectroplatingSurface FinishingSemiconductorPCBLean

About the role

Key responsibilities & impact

Data Package Generation: Design and execute systematic studies to characterize new plating chemical systems, including process window mapping (DoE), bath life studies, and by-products tolerance testing.
POR Implementation: Author and deliver technical reports, SOPs, and "Best Known Methods" (BKMs) to facilitate the transition of chemistry from application testing to high volume manufacturing.
Electrochemical Analysis: Lead the development of analytical control methods using CVS (Cyclic Voltammetric Stripping), Hull Cell analysis, and potentiostatic techniques to ensure bath stability.
Customer Consultation: Act as a subject matter expert during technical reviews and troubleshooting sessions. Identify root causes for plating defects and lack of functional performance and provide corrective actions.
Metrology Leadership: Utilize SEM/EDX, XRF, X-section and 3D profiler to characterize deposit properties such as morphology, grain structure, and thickness uniformity.

Requirements

What you’ll need

Master’s degree or above in chemistry, chemical Engineering or Material Science.
> 5 years in the electroplating or surface finishing industries, specifically within the semiconductor or PCB.
A team player able to work effectively and constructively with other team members and other functions in the company.
Strong communication skills, both verbal and written, with capability to develop and maintain internal and external business relationships.
Experience with statistics and experimental design (Six Sigma, Lean, DOE).
Prioritizes safety of self and team and actively contributes to a culture of safety.

Benefits

Comp & perks

A competitive salary with annual bonuses.
Access to state-of-the-art research facilities with a high level of safety standards.
A work environment located at the Industrial Technology Research Institute, surrounded by cutting-edge research and innovation.
Ample research resources to support your work and development in a collaborative team setting.
Opportunities for international business trips to collaborate with global teams and expand your network.
Comprehensive internal and external training programs to foster continuous learning and professional growth.
The chance to work on advanced technologies and collaborate with world-leading companies such as TSMC and Intel in developing cutting-edge technologies.
A generous benefits package, including seven days of paid leave and travel allowances to support your personal well-being and work-life balance.