R&D Application Engineer – Level III

Element Solutions Inc

Application Engineer developing next-generation electronic materials at MacDermid Alpha Electronics Solutions. Bridging product technology with customer applications in a laboratory-focused role.

Posted 5/5/2026full-time🇺🇸 United StatesMid-LevelSeniorWebsite

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Support development, validation, and optimization of next‑generation electronic materials, including advanced die attach solutions and sintered nanomaterials.
Troubleshoot issues faced by customer during or post new product introduction (NPI) stage.
Conduct failure mode analysis, identify defects, material related issues, and recommend improvements.
Perform product evaluations, trials, and performance testing.
Support sample build campaigns by designing builds, commissioning for production using specialized tools.
Optimize application processes & conditions, or product usage guidelines.
Prepare technical reports, test summaries, and recommendations.
Conduct field trials or on site customer testing.
Translate customer needs into technical requirements for internal teams.
Work closely with R&D, customer technical support, sales, and product management to support new product introductions and technical projects.
Operate and manage laboratory application process equipment including screen printers, pick-and-place machines, reflow ovens, sinter presses, environmental test chambers, die shear machines, and electrical probing systems.
Perform periodic maintenance on assigned equipment to ensure optimal working conditions.
Ensure technical documentation is accurate, up to date, and compliant with industry regulations.
Own ISO/EHS compliance, documentation discipline, and lab operational excellence.

Requirements

What you’ll need

B.E. / MSc/ M.E. / MTech in Electronics, Materials Science, Nanotechnology, Physics, or related fields.
5+ years of experience in semiconductor assembly or materials-based application process development.
Experience with die attach or advanced packaging preferred.
Strong analytical thinking and problem‑solving.
Excellent documentation and communication.
Ability to manage multiple projects.
Proficiency with DOE, ANOVA, MSA, FMEA.
Strong skills in Excel and Minitab.
Familiar with CAD tools like SolidWorks.

Benefits

Comp & perks

As part of our team here, in addition to a competitive Gross Salary you will be eligible to participate in a generous performance-related bonus scheme.
You will receive 3 comprehensive insurance benefits 1. GMC (Self/ Spouse and 2 Kids – INR 5 Lakhs coverage), 2. GPA – 5 Times of Annual Salary sum assured for Employee, 3. GTLI - 5 Times of Annual Salary sum assured for Employee

ATS Keywords

✓ Tailor your resume

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

semiconductor assemblymaterials-based application process developmentdie attachadvanced packagingfailure mode analysisperformance testingdesigning buildsapplication process optimizationtechnical documentationISO compliance

Soft Skills

analytical thinkingproblem-solvingdocumentationcommunicationproject management