Principal Packaging Engineer

Delos Data

Senior Packaging Engineer architecting and delivering advanced multi-die IC packages for high-performance AI accelerators. Collaborating with design and vendor teams in a stealth-mode startup environment.

Posted 6/11/2026full-timePalo Alto • California • 🇺🇸 United StatesLead💰 $180,000 - $240,000 per yearWebsite

About the role

Key responsibilities & impact

Select and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability.
Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints.
Define substrate stack‑ups, bump pitch, ball pitch, routing, via structures, and material choices for performance and manufacturability.
Perform high-speed signal escaping, routing and power distribution network design.
Manage subcontractors and work directly with TSMC and/or OSAT on bumping, substrate options, and advanced packaging flows.
Partner with IC design, physical design, SI/PI, and board teams to ensure package requirements meet system‑level needs.
Evaluate emerging packaging technologies and drive adoption for next‑generation products.
Support package‑level bring‑up, failure analysis, debug and qualification.

Requirements

What you’ll need

B.S./M.S. in Electrical Engineering or related field
Experience with multi‑die package design and UCIe (AP/SP) integration
Understanding of substrate materials, stack‑ups, and mechanical constraints
Familiarity with SI/PI concepts to collaborate effectively with electrical teams
Experience managing packaging subcontractors
Experience interfacing with TSMC/OSAT for bumping and packaging options
Knowledge of package modeling tools (HFSS, Sigrity, or similar) is a plus.

Benefits

Comp & perks

meaningful equity
benefits
401k

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

multi-die package designUCIe integrationsubstrate materialsstack-upsmechanical constraintshigh-speed signal escapingrouting designpower distribution network designfailure analysisdebug

Soft Skills

collaborationmanagement

Certifications

B.S. in Electrical EngineeringM.S. in Electrical Engineering