Engineer

• The position plays a pivotal role in implementing, and supporting advanced liquid-cooled / air-cooled AI Inference solutions tailored to meet the needs of enterprise and high-performance computing (HPC) environments
• Responsible for the thermal architecture, thermal design, analysis, and validation of thermal technologies within AI Accelerator Card and Server products
• Develop and integrate innovative thermal solutions/applications by collaborating with design, testing, and engineering teams
• Lead the design, deployment, and delivery of liquid cooled / air-cooled, HPC and AI supercomputing projects, ensuring alignment with performance, quality, and timeline expectations
• Evaluate the system layout, power consumptions, air flow, acoustics, sensors and related mechanical requirements
• Perform component, system and rack level thermal and mechanical design for cooling systems
• Manage data center projects from conception to delivery, ensuring high levels of customer satisfaction
• Understand system design requirements for High Performance Computing and AI workloads to drive platform configuration guides for x86 and ARM servers
• Prepare product drawings, BOM, SOP, DFM and system design/test reports
• Thermal/mechanical debugging, system optimization and documentation
• Analyze structural and thermal aspects to ensure feasibility and specify thermal interface materials and manufacturing process
• Provide identification and creation of new techniques to advance thermal/mechanical development and validation

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