Hardware Engineering Technical Leader

Cisco

Senior Photonics Packaging Engineer on the Acacia Packaging Engineering team. Responsible for developing next-generation optical communication products and collaborating with cross-functional teams.

Posted 8/3/2026full-timeHolmdel • Massachusetts, New Jersey • 🇺🇸 United StatesSenior💰 $191,400 - $281,400 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in optical transceiver assembly process development, wafer-level packaging, and mechanical assembly automation. Proven ability to lead cross-functional teams and optimize manufacturing processes in high-volume production environments.

Highest-signal resume keywords

Optical Transceiver Assembly Process DevelopmentWafer-Level PackagingDesign Of Experiments (DOE)Materials CharacterizationHigh-Volume Production

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Back-End Wafer ProcessingFailure AnalysisIC Packaging MaterialsSemiconductor Packaging ManufacturingProcess Optimization

Soft Skills

Cross-Functional Team LeadershipProblem Solving

Tools & Technologies

Mechanical Assembly Automation Equipment

Industry Keywords

Manufacturing ProcessesContract ManufacturingProduct Manufacturability

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Lead technical ownership of optical transceiver assembly process development
Develop high-volume, highly automated, and cost-effective manufacturing processes
Drive the development and optimization of 2D/2.5D/3D wafer-level packaging processes
Design and implement Design of Experiments (DOE) to optimize process capability
Serve as the in-house technical expert for wafer-level packaging and mechanical assembly automation equipment
Partner cross-functionally with design, test, reliability, and manufacturing teams to improve product manufacturability

Requirements

What you’ll need

Bachelor’s degree in Physics, Mechanical Engineering, Materials Science, or a related field with 12+ years of experience, or Masters + 8 years of related experience, or PhD + 5 years of related experience
8+ years of experience in back-end wafer processing
expertise in materials characterization, failure analysis, IC packaging materials, and semiconductor packaging manufacturing processes
experience managing overseas contract manufacturers
leading cross-functional teams to resolve manufacturing issues
delivering consistent results in high-volume production environments

Benefits

Comp & perks

medical, dental and vision insurance
401(k) plan with a Cisco matching contribution
paid parental leave
short and long-term disability coverage
basic life insurance
10 paid holidays per full calendar year
1 floating holiday for non-exempt employees
1 paid day off for employee’s birthday
paid year-end holiday shutdown
4 paid days off for personal wellness determined by Cisco
16 days of paid vacation time per full calendar year, accrued at rate of 4.92 hours per pay period for full-time employees
flexible vacation time off program
80 hours of sick time off provided on hire date and each January 1st thereafter
up to 80 hours of unused sick time carried forward from one calendar year to the next
optional 10 paid days per full calendar year to volunteer
annual bonuses subject to Cisco’s policies
performance-based incentive pay for sales roles