Silicon Photonics Packaging Technical Leader

Cisco

Packaging Technical Leader responsible for advanced packaging solutions at Cisco, powering next-gen optical transceiver products. Over 8 years of experience in Photonics or Semiconductor Packaging required.

Posted 7/24/2026full-timeSan Jose • California, Pennsylvania • 🇺🇸 United StatesSenior💰 $168,800 - $241,200 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in advanced packaging solutions for optical transceivers, with a strong focus on Silicon Photonic package technology development and substrate design. Proven ability to lead cross-functional teams, conduct rigorous design reviews, and influence package architecture while ensuring quality and reliability standards.

Highest-signal resume keywords

Advanced Silicon Photonic Package Technology DevelopmentSubstrate Design & ArchitectureDesign & Simulation Software (Cadence, Klayout, Ansys)Cross-Functional Technical LeadershipRisk Mitigation & Quality Assurance

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Silicon Photonic Package Technology2.5D/3D IntegrationTSVFlip-ChipStackingHybrid IntegrationWafer-Level PackagingPackage Technology Qualification MethodsAdvanced Substrate Manufacturing ProcessesSignal/Power Integrity

Soft Skills

Technical CommunicationCollaborationProblem SolvingLeadership

Tools & Technologies

CadenceKlayoutAnsys

Industry Keywords

PhotonicsSemiconductor PackagingDesign for Manufacturing (DfM)Design for Reliability (DfR)

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

responsible for the development and qualification of advanced packaging solutions for Cisco’s next generation optical transceiver products
serve as the primary technical interface for the Client Optics Group with top-tier Outsourced Semiconductor Assembly & Test (OSAT)
lead the design and layout of test vehicles to validate packaging processes
conduct rigorous design reviews for complex substrates, ensuring alignment with signal/power integrity requirements and manufacturing capabilities
cross-functional technical leadership to proactively identify and mitigate risks, resolve highly complex assembly issues, and establish best-in-class quality and reliability standards across the supply chain
work collaboratively with other internal teams to influence package architecture and provide expert guidance on DfM, DfR
engage deeply in substrate design, materials selection, and reviews
present technical findings and recommendations to cross-functional teams and stakeholders
stay informed on emerging packaging technologies and industry trends

Requirements

What you’ll need

Masters Degree in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field with 8+ years of experience in Photonics or Semiconductor Packaging Industry or a PhD in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field with 3+ years of experience in Photonics or Semiconductor Packaging Industry
Proven experience in advanced Silicon Photonic package technology development, such as 2.5D/3D integration, TSV, flip-chip, stacking, hybrid integration, wafer-level packaging, and package technology qualification methods
Prior experience of package design & architecture, including substrate design and chip fabrication
Experience with advanced substrate manufacturing processes and materials and their impacts to device level signal and power integrity
Experience with industry-standard design and simulation software (e.g., Cadence, klayout, Ansys or similar tools)

Benefits

Comp & perks

medical, dental and vision insurance
a 401(k) plan with a Cisco matching contribution
paid parental leave
short and long-term disability coverage
basic life insurance
grants of Cisco restricted stock units
10 paid holidays per full calendar year
1 floating holiday for non-exempt employees
1 paid day off for employee’s birthday
paid year-end holiday shutdown
4 paid days off for personal wellness
16 days of paid vacation time per full calendar year
flexible vacation time off program
80 hours of sick time off provided on hire date and each January 1st thereafter
additional paid time away may be requested to deal with critical or emergency issues for family members
optional 10 paid days per full calendar year to volunteer