ASIC Engineer

Cisco

Technical expert in advanced semiconductor packaging technologies for Cisco. Leading and resolving technical challenges in assembly solutions with cross-functional collaboration and innovative approaches.

Posted 7/4/2026full-timeTaipei • 🇹🇼 TaiwanMid-LevelSeniorWebsite

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Serve as a technical expert for advanced packaging technologies, 2.5D/3D
Work directly with key suppliers to develop and enable new processes
Engage with leading assembly suppliers to understand assembly process
Define assembly process integration and flow for advanced multiple die heterogeneous integration
Develop comprehensive plans of assembly and reliability
Resolve design challenges and implement working solutions using DfM/DfR principles

Requirements

What you’ll need

BS/MS/PhD in Mechanical Engineering, Materials Science, Physics or a closely related field
5+ years of progressive experience in Semiconductor Packaging and Assembly Industry
Proven experience in advanced packaging technology development and execution
Comprehensive knowledge and understanding of advanced CoWoS package assembly and manufacturing flow
Previous experience with substrate manufacturing processes and design rules
Experience with package design physical attribute and material selection

Benefits

Comp & perks

Health insurance
Flexible working hours
Professional development opportunities

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

Advanced Packaging TechnologiesAssembly Process IntegrationReliability PlanningDesign for ManufacturingDesign for ReliabilityPhysical Attribute DesignMaterial SelectionHeterogeneous IntegrationProcess DevelopmentManufacturing Flow