Senior Business Development Manager – China Region, IP: DSP, CPU

Cadence Design Systems

Business Development Manager focusing on Tensilica DSP and CPU technologies for Cadence in China. Engaging with automotive and consumer SoC teams to drive IP licensing growth.

Posted 4/14/2026full-timeShanghai • 🇨🇳 ChinaSeniorWebsite

Tech Stack

Tools & technologies

IoT

About the role

Key responsibilities & impact

Drive IP licensing growth in China, with a strong focus on Tensilica DSP and CPU technologies.
Engage with SoC teams in automotive, AR/VR, mobile, smart speakers, TWS, and broader consumer markets.
Identify and qualify new business opportunities, expand existing accounts, and manage the full sales cycle.
Understand customer architecture requirements, future roadmaps, and competitive offerings to position Tensilica IP effectively.
Work closely with China sales teams to develop and execute regional account strategies.
Build, develop, and nurture relationships with key software vendors.
Advocate Tensilica DSPs by driving partner onboarding, technical enablement, performance optimization, and joint solution development.
Develop China-specific go-to-market strategies for automotive and consumer segments.
Monitor industry trends, emerging workloads, regulatory standards, and local ecosystem shifts.
Represent the company at China industry conferences, partner workshops, customer summits, and semiconductor forums.

Requirements

What you’ll need

Bachelor’s or Master’s in Electrical Engineering, Computer Engineering, or related discipline.
10+ years of experience in semiconductor IP, DSP/CPU/NPU technologies, SoC design, embedded software, or related business development roles.
Strong technical understanding of DSP architectures, signal processing, embedded systems, and AI workloads.
Proven success selling semiconductor IP or building technical business engagements in China.
Familiarity with software ecosystems in audio, voice, AI/ML, AR/VR, and automotive domains.
Excellent communication, negotiation, and relationship-building skills.
Ability to travel within China and internationally.
Direct experience with Tensilica DSPs or similar configurable DSP architectures (preferred).
Existing relationships with China automotive SoC vendors, Smartphone/IoT/CE chipmakers, AR/VR and edge-AI solution developers, and leading software algorithm partners (preferred).

Benefits

Comp & perks

Equal Employment Opportunity Policy
Accessibility accommodations
Privacy Policy

ATS Keywords

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Hard Skills & Tools

DSP technologiesCPU technologiesNPU technologiesSoC designembedded softwaresignal processingembedded systemsAI workloadsTensilica DSPstechnical business engagements

Soft Skills

communicationnegotiationrelationship-building

Certifications

Bachelor’s in Electrical EngineeringMaster’s in Electrical EngineeringBachelor’s in Computer EngineeringMaster’s in Computer Engineering