PIC Packaging and Characterization Engineer

Breega

PIC Packaging and Characterization Engineer at InSpek developing PIC-based sensing probes. Collaborating with engineers and coordinating supplier relationships in a dynamic startup environment.

Posted 7/18/2026full-timeParis • 🇫🇷 FranceJuniorMid-LevelWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in PIC packaging and optical characterization, with a strong focus on process optimization, documentation, and supplier coordination. Capable of troubleshooting optical systems and managing workflows effectively across teams and external partners.

Highest-signal resume keywords

PIC PackagingOptical Characterization ToolsSupplier CoordinationDocumentation ManagementOptical System Troubleshooting

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

PIC-Based ProductsOptical FibresFree-Space Optical ComponentsAssembly ProtocolsQuality ChecksProcess OptimizationComponent ValidationWorkflow ManagementSignal Noise TroubleshootingChip Module Characterization

Soft Skills

Good Communication SkillsOrganizedPrecise

Tools & Technologies

LasersPower-MetersSpectrometers

Industry Keywords

Optical TestingSupplier DocumentationCross-Functional DebuggingRaman SpectroscopyLaser-Based Sensing Systems

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Own the physical realization of PIC-based sensing probes — from PIC packaging through chip module characterization and supplier coordination.
Collaborate closely with our photonics and applications engineers and share optical testing responsibilities with the team.
PIC packaging: fibre-to-chip coupling, thermal and glue considerations.
Optical component sourcing and qualification (fibers, filters, isolators, laser sources).
Troubleshoot optical system issues: coupling, polarization, alignment, signal noise.
Own assembly protocols and process documentation; keep records current in internal tracking systems.
Characterize chips and perform quality checks before and after packaging.
Develop packaging process alongside packaging partners and in-house to optimize repeatability and yield.
Coordinate packaging runs and assembly workflows with external subcontractors.
Act as the primary technical contact with packaging subcontractors and component suppliers.
Define technical requirements, review proposals, and manage incoming component validation.
Manage procurement, timelines, and supplier documentation.
Build and maintain assembly protocols; ensure documentation is complete and traceable after each run.
Support cross-functional debugging by maintaining clear records of what changed between runs.

Requirements

What you’ll need

2+ years of industrial experience working with PIC-based products
Hands-on experience in PIC packaging
Comfortable working with PICs, optical fibres, and free-space optical components
Practical experience with optical characterization tools (lasers, power-meters, spectrometers)
Organized and precise — able to own a workflow end-to-end with good documentation habits
Willing to work across domains and learn new understanding related to our field of application.
Good communication skills; able to coordinate effectively with internal teams and external suppliers
Fluency in English; French is a plus
Nice-to-have:
Experience with surface spotting or chip functionalization workflows
Familiarity with Raman spectroscopy or laser-based sensing systems

Benefits

Comp & perks

Health and life insurance (100%)
Meal vouchers
Gymlib account (access to gyms & sports)
Employee stock options (BSPCE)
Flexible remote work policy
Regular social events
Growth opportunities with potential for leadership roles
Inclusive culture
Unique opportunity to be an early employee at an innovative startup