Lead the design and development of state-of-the-art RF/mmWave front-end chipsets
Partner with RF system engineers to run feasibility studies and architect RF/mmWave transmitter and receiver front-ends
Oversee the design and simulation of on-chip electromagnetic (EM) structures
Collaborate with the package engineering team on co-optimization of IC/package interfaces
Supervise chip-level front-end integration and optimization throughout the development lifecycle
Ensure successful production and oversee design progress with third-party design partners

Requirements

15+ years of experience in millimeter-wave/RFIC design using SiGe, CMOS, and SOI technologies
Strong experience with various circuit topologies for amplifiers, mixers, switches, and synthesizers
Strong expertise in the analysis and optimization of transmitter and receiver front-ends for complex modulated waveforms
Experience with analog building blocks such as operational amplifiers, bias generators, temperature sensors, LDOs, and ADC/DAC implementations
Proficiency in EM simulations for both on-chip and package components
Prior experience with top-level integration including ESD, mixed-signal/mixed-mode verification, and DFM concepts
Must be a U.S. citizen or national, U.S. permanent resident, or lawfully admitted into the U.S. as a refugee or granted asylum

Benefits

Medical, dental, vision, basic and supplemental life insurance
Paid parental leave
Short and long-term disability
401(k) with a company match of up to 5%
Education Support Program
Up to four (4) weeks paid time off per year based on weekly scheduled hours
Up to 14 company-paid holidays

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

RF/mmWave designRFIC designSiGe technologyCMOS technologySOI technologycircuit topologiestransmitter front-end analysisreceiver front-end analysisEM simulationsanalog building blocks

Soft Skills

leadershipcollaborationsupervisionproject management