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Black Semiconductor

Senior Equipment Engineer – Wafer Lamination, Mounting

Black Semiconductor

Senior Equipment Engineer overseeing wafer lamination and mounting equipment for semiconductor solutions. Ensuring quality and reliability in high-volume manufacturing environments.

Posted 6/18/2026full-timeAachen • 🇩🇪 GermanySeniorWebsite

Tech Stack

Tools & technologies
Assembly

About the role

Key responsibilities & impact
  • Lead the installation, maintenance, and optimization of wafer taping and mounting equipment.
  • Own the health and performance of fully automated lamination modules.
  • Maximize product quality through equipment reliability and process stability.
  • Optimize tape application parameters and eliminate lamination-related failure modes.
  • Introduce novel technology to high-volume manufacturing.
  • Drive root-cause analysis and permanent corrective actions for equipment failures and yield loss.
  • Collaborate with Process Engineering to optimize equipment configurations.

Requirements

What you’ll need
  • Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Mechatronics, or related technical field, or equivalent experience.
  • 5+ years of semiconductor equipment engineering experience within Back-End Assembly, Advanced Packaging, Wafer Thinning, or related manufacturing areas.
  • Hands-on experience maintaining and troubleshooting wafer tape-frame equipment (e.g.: Takatori, Disco, Adwill-Lintec, Tazmo, or similar).
  • Strong knowledge of pneumatics, servo systems, robotics, wafer handling, motion control, sensors, vacuum systems, and industrial automation.
  • Experience working in ISO 5/6 (Class 100/1000) cleanroom environments.
  • Experience with temporary bond/debond, wafer backgrind, UV irradiation, or related backend processes will be considered a plus

Benefits

Comp & perks
  • Comprehensive benefits package
  • Outstanding insurance
  • Pension
  • Virtual stock options

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools
wafer tapinglamination modulesroot-cause analysisprocess stabilitytape application parameterstroubleshootingpneumaticsservo systemsroboticsindustrial automation
Soft Skills
collaborationproblem-solvinganalytical thinkingattention to detailcommunication