Mechanical & Thermal Staff Engineer

Axelera AI

Staff Mechanical & Thermal Engineer designing and validating cooling solutions for AI accelerator cards at Axelera AI in Eindhoven. Collaborating closely with industry partners and suppliers to optimize thermal performance.

Posted 5/26/2026full-timeEindhoven • 🇳🇱 NetherlandsLeadWebsite

Tech Stack

Tools & technologies

AirflowLinuxPython

About the role

Key responsibilities & impact

Lead the design of Axelera's AI accelerator cards and platforms, ensuring mechanical fit and thermal performance from concept to production hand-off
Test and validate the cooling solution end-to-end, including thermal simulation, simulation-to-test correlation, lab execution, and characterisation reporting suitable for senior management, suppliers, and customers
Own the cooling-solution life-cycle from concept and structured trade-off analysis through validation and production hand-off, in close collaboration with industry partners, OEM customers, and external suppliers
Architect cooling solutions across the full technology set: passive heat sinks, heat pipes, vapor chambers, cold plates, and heat spreaders for fanless systems
Drive make-or-buy decisions; manage in-house design or supplier-outsourced development accordingly
Run the full CFD cycle (model setup → correlation with test data) from chip to system level
Lead structured trade-off analysis and arrive at design reviews with clear, evidence-based recommendations
Partner with PCB and electronics engineers to co-optimise thermal and electrical design from the start
Define and execute validation plans with documented simulation-to-test correlation
Run hands-on thermal lab work: chambers, multi-channel DAQ, thermocouples, airflow and power measurements
Apply DOE methodology to plan campaigns efficiently within constrained test budgets
Automate measurement workflows and post-processing pipelines in Python
Produce clear characterisation reports usable by management, suppliers, and customers without further interpretation
Scout, qualify, and manage cooling suppliers across the full lifecycle: NRE, sample qualification, design freeze, production transfer, quality resolution (8D)
Maintain project planning in Jira/Confluence and communicate status proactively across functions

Requirements

What you’ll need

10+ years in board/system-level mechanical and thermal design for electronics, including HPC-class platforms
Demonstrated experience with PCIe accelerator cards, M.2 thermal solutions, and fanless embedded systems
Full ownership of CFD/FEM simulation cycles (FloEFD, Icepak or equivalent)
High-TDP chip cooling (200 W+), forced-air server integration, heat pipe and vapor chamber design
Proficiency in 3D CAD (NX, SolidWorks, or similar) and rapid prototyping (3D printing, CNC)
Python for test automation and data post-processing; comfortable in Linux environments
Solid grasp of DOE, uncertainty analysis, and simulation-to-test correlation methodologies
Track record of supplier management including NRE negotiation and quality issue resolution
Strong communicator — able to deliver concise technical conclusions to senior stakeholders
Fluent in English; comfortable working across multicultural, distributed teams

Benefits

Comp & perks

Attractive compensation package
Pension plan
Extensive employee insurances
Option to get company shares
Open culture that supports creativity and continual innovation

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

mechanical designthermal designCFD simulationFEM simulationthermal validationDOE methodology3D CADtest automationdata post-processinghigh-TDP chip cooling

Soft Skills

strong communicatorcollaborationproject planningevidence-based recommendationsstatus communication