Axelera AI

Application Engineer

• Senior primary technical contact for EMEA customers, engaging from engineers to senior leadership
• Lead hardware bring-up, board integration, and embedded system debugging on-site and remotely
• Support chip-down design, custom carrier board development, and embedded Linux integration
• Guide customers deploying AI models and inference pipelines via the Voyager SDK
• Debug PCIe, power sequencing, signal integrity, thermal, and BSP bring-up issues
• Drive pre-sales engagement and design wins across OEM/ODM, integrators, and end users across Europe.
• Build FAE processes, documentation, and support infrastructure for the EMEA region
• Recruit, mentor, and manage EMEA FAE engineers as the team scales
• Align priorities with commercial goals; contribute to EMEA and global FAE strategy
• Act as the senior technical bridge between EMEA customer needs and global R&D and Product teams
• Surface customer feedback and roadmap input to Product Management and R&D
• Maintain relationships with key accounts, distributors, and channel partners across EMEA
• Partner with Sales and BD on product introductions, onboarding, and competitive intelligence
• Represent Axelera AI at EMEA industry events, conferences, and technical forums

Director – Field Application Engineering, EMEA

Full-stack Engineer

• Lead the design of Axelera's AI accelerator cards and platforms, ensuring mechanical fit and thermal performance from concept to production hand-off
• Test and validate the cooling solution end-to-end, including thermal simulation, simulation-to-test correlation, lab execution, and characterisation reporting suitable for senior management, suppliers, and customers
• Own the cooling-solution life-cycle from concept and structured trade-off analysis through validation and production hand-off, in close collaboration with industry partners, OEM customers, and external suppliers
• Architect cooling solutions across the full technology set: passive heat sinks, heat pipes, vapor chambers, cold plates, and heat spreaders for fanless systems
• Drive make-or-buy decisions; manage in-house design or supplier-outsourced development accordingly
• Run the full CFD cycle (model setup → correlation with test data) from chip to system level
• Lead structured trade-off analysis and arrive at design reviews with clear, evidence-based recommendations
• Partner with PCB and electronics engineers to co-optimise thermal and electrical design from the start
• Define and execute validation plans with documented simulation-to-test correlation
• Run hands-on thermal lab work: chambers, multi-channel DAQ, thermocouples, airflow and power measurements
• Apply DOE methodology to plan campaigns efficiently within constrained test budgets
• Automate measurement workflows and post-processing pipelines in Python
• Produce clear characterisation reports usable by management, suppliers, and customers without further interpretation
• Scout, qualify, and manage cooling suppliers across the full lifecycle: NRE, sample qualification, design freeze, production transfer, quality resolution (8D)
• Maintain project planning in Jira/Confluence and communicate status proactively across functions

Director – Field Application Engineering, EMEA

Mechanical & Thermal Staff Engineer