Bonding Technology Process Development Engineer, Entry-level
Applied Materials
full-time
Posted on:
Location Type: Office
Location: Singapore • Singapore
Visit company websiteExplore more
Job Level
About the role
- Develop pretreatment processes for both conventional and unconventional test vehicles in CoW hybrid bonding applications
- Propose solutions to address the unique challenges for high-yield hybrid bonding and die stacking
- Proactively initiate and conduct CnF tests to define process & hardware requirements
- Collaborate with partners to evaluate different pretreatment technologies to identify the best for HBM
- Deep dive with engineering team and/or supplier to prototype next gen pretreatment modules based on identified technology and process & hardware requirements
- Evaluate proto chamber for hybrid bonding process for HBM
- Own process optimization and drive engineering improvement
- Guide account/field teams on tough technical issues
Requirements
- Engineering or science university educational background
- Academic background on plasma, wet clean, and/or thermal module is a big plus
- Prior hands-on experience with industrial and/or lab-scale plasma or wet cleans tools and processes is a strong plus
- 10% travel commitment to the US, Taiwan, Korea or Europe
Benefits
- Supportive work culture that encourages to learn, develop, and grow career
- Programs and support for personal and professional growth
- Health and wellbeing programs
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
process optimizationhybrid bondingdie stackingCnF testspretreatment processesplasma toolswet clean processesthermal module
Soft Skills
collaborationproblem-solvingtechnical guidance