Alice & Bob

Superconducting Chip Design Internship

Alice & Bob

internship

Posted on:

Location Type: Hybrid

Location: ParisFrance

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About the role

  • Review and analyze existing methods for estimating and measuring energy participation ratios (EPR) in superconducting circuits.
  • Design and simulate a testbed using conventional FEM tools (e.g., Ansys HFSS) to enable accurate measurement of internal loss of a chip.
  • Design a series of superconducting chips to validate the testbed and enable extraction of loss contributions associated with each material interface.
  • Design the interfaces between the chips and the testbed, including integration with wiring inside a dilution refrigerator.
  • Plan the integration of test chips within standard fabrication processes and workflows.
  • Develop measurement and analysis methodologies to robustly quantify loss contributions from individual interfaces.
  • Collaborate with circuit designers to translate simulation results into qubit design guidelines and optimizations.
  • Document methods, scripts, and results in a clear and reproducible manner for use by team members and future projects.
  • Present findings in team meetings and contribute to design reviews for next-generation superconducting qubit architectures.

Requirements

  • You are currently enrolled in a Master's degree in Engineering or Physics
  • Available for a 5-6 months internship (ideally from August 2026).
  • Prior knowledge of electromagnetic field theory.
  • First-hand experience with electromagnetic solvers (e.g: Ansys).
  • Experience with Python.
  • Proficient English skills, both written and spoken.
  • A strong curiosity and openness to new ideas
  • Research skills (going through existing literature, testing new methods)
Benefits
  • 1 day off per month
  • Half of transportation cost coverage (as per French law)
  • Meal vouchers with Swile, as well as access to a fully equipped and regularly stocked kitchen
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
electromagnetic field theoryelectromagnetic solversPythonmeasurement methodologiesanalysis methodologiessuperconducting circuitstestbed designchip designloss contributionsfabrication processes
Soft Skills
curiosityopenness to new ideasresearch skillscommunication skillscollaborationdocumentationpresentation skills
Certifications
Master's degree in EngineeringMaster's degree in Physics