Lead Engineer, 3D Integration – Advanced Packaging

Quantum Motion

Lead Engineer supervising R&D of 3D integration for quantum computing devices. Joining a creative team at a pioneering company aiming to revolutionize quantum technologies in London.

Posted 6/30/2026full-timeLondon • 🇬🇧 United KingdomSeniorWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in 3D integration and packaging for quantum modules, with a strong focus on managing engineering teams and technical transfers in high-tech environments. Proficient in cryogenic electronics and materials behavior at extreme temperatures.

Highest-signal resume keywords

3D IntegrationTeam LeadershipTechnical Transfer ManagementCryogenic ElectronicsSimulation Tools Proficiency

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

3D Integrated CircuitsTSVsFine-Pitch MicrobumpsFlip-Chip BondingMulti-Chip ModulesFailure AnalysisYield ImprovementMaterials BehaviorQuantum MechanicsSemiconductor Physics

Soft Skills

MentoringCollaborationStrategic ThinkingProblem Solving

Tools & Technologies

Ansys HFSSCadence

Industry Keywords

Cryogenic R&DThermal CyclingPackaging ArchitecturesExternal FoundriesOSATs

About the role

Key responsibilities & impact

Build and lead a team to drive the R&D of complex, multi-chip modules utilising TSVs and microbumps, optimised to operate at millikelvin temperatures
Recruit, mentor, and lead a high-performing team of packaging, signal integrity, materials, and quantum integration engineers
Drive the strategy, design, and rapid prototyping of 3D integrated circuits and multi-chip quantum modules
Ensure all packaging architectures and interconnects can withstand thermal cycling down to millikelvin regimes without delamination or performance degradation
Own relevant operations with external foundries, OSATs, and research partners
Seamlessly transfer novel packaging designs to external manufacturing lines
Serve as the critical link between design, process integration, cryo R&D, and quantum hardware teams to co-optimise the electrical, thermal, and mechanical design
Balance rapid R&D prototyping with a rigorous, parallel focus on yield improvement, failure analysis, and long-term reliability

Requirements

What you’ll need

Master’s or PhD in electrical engineering, materials science, physics, microelectronics, or related field
7+ years deep technical experience in 3D integration, specifically with TSVs, fine-pitch microbumps, flip-chip bonding, and/or multi-chip modules
Proven track record or building, scaling, and managing engineering teams in high-tech, fast-paced environments
Strong experience managing technical transfers and working closely with external semiconductor foundries or advanced packaging facilities
Proficiency with industry-standard simulation tools (e.g., Ansys HFSS/Q3D, Cadence)
Direct experience with cryogenic electronics
Background or strong familiarity with solid-state quantum mechanics, silicon spin qubits, or semiconductor physics
Knowledge of materials behaviour (superconductors, low loss dielectrics) at extreme temperatures

Benefits

Comp & perks

Be part of a creative, world-leading team
Competitive salary and share options scheme
Contributory pension scheme
Group private medical insurance scheme
Life Assurance
Cycle-to-work Scheme
Central London location