Staff IC Substrate Development Engineer

Qorvo, Inc.

IC Substrate Development Engineer at Qorvo leveraging expertise in substrate development for semiconductor applications. Collaborating with suppliers and design teams on innovative solutions in a fast-paced environment.

Posted 5/22/2026full-timeGreensboro • Florida, North Carolina, Texas • 🇺🇸 United StatesLeadWebsite

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Interface between Qorvo design community and worldwide supply base to create technology roadmaps to support future products.
Develop, qualify, and support clean launch of new laminate PCB material sets and suppliers in line with centralized Qorvo processes and documentation standards.
Design material and surface finish evaluations using screening tests and design of experiments to improve product attributes such as RF performance, MSL rating, lower cost, or size reduction.
Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
Apply problem solving skills and knowledge to solve challenges related to new technologies or improve existing supply chain capabilities.
Travel to laminate suppliers to provide technical support for technology development, supplier qualification and problem resolution.

Requirements

What you’ll need

8+ years of experience (or an equivalent combination of advanced education and experience) in PCB and/or IC substrate manufacturing.
Bachelor's degree in Chemistry or an Engineering discipline.
Strong communication skills.
Familiarity across a wide range of assembly/packaging process technologies and materials such as SMT, Die Attach, Wire Bond / Flip Chip, Molding, Multi-layer laminates, etc.
Industry knowledge and experience with laminate/PCB manufacturing including processes such as Cu pattern plating, panel plating, via drill, surface finishes, etc.
Knowledge of dielectric materials such as prepreg, ABF, RCC, etc.
Recognized understanding of IPC PCB and JEDEC standards.
Strong background in PCB design rules, manufacturing and qualification standards.
Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g. DMAIC, 8D).
Understanding of Design for Manufacturability and requirements needed to ramp technologies in a high volume-manufacturing environment.
Knowledgeable and up to date network within subcontractors to support advanced packaging technology.
Proven record of accomplishment in supporting New Product, Processes, and/or Technology through innovative packaging solutions.

Benefits

Comp & perks

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible.
Full onsite position (5 days/week).
Strong communication and collaboration skills are essential.

ATS Keywords

✓ Tailor your resume

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

PCB manufacturingIC substrate manufacturingprogram managementdesign of experimentsproblem solvingSPC techniquesDOEDesign for Manufacturabilitylaminate materialsdielectric materials

Soft Skills

strong communication skills

Certifications

IPC PCB standardsJEDEC standards