Principal Engineer – Laminate Substrate Development

Qorvo, Inc.

IC Substrate Development Engineer at Qorvo specializing in high density interconnect substrate development for semiconductor applications. Collaborating with design teams to develop new substrate technologies for next generation products.

Posted 5/14/2026full-timeSeoul • 🇰🇷 South KoreaLeadWebsite

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Interface between Qorvo design community and worldwide supply base to create technology roadmaps to support future products.
Develop, qualify, and support clean launch of new laminate material sets and suppliers in line with centralized Qorvo processes and documentation standards.
Design material and surface finish evaluations using screening tests and design of experiments to improve product attributes such as RF performance, MSL rating, lower cost, or size reduction.
Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
Apply problem solving skills and knowledge to solve challenges related to new technologies or improve existing supply chain capabilities.
Travel to laminate suppliers to provide technical support for technology development, supplier qualification and problem resolution.

Requirements

What you’ll need

10+ years’ direct experience in PCB/mSAP laminate manufacturing
Bachelors or higher degree in Chemistry or Engineering disciplines
Strong communication skills
Industry knowledge and experience with laminate/PCB manufacturing including processes such as mSAP Cu pattern plating, panel plating, surface finishes, etc.
Familiarity across a wide range of assembly/packaging process technologies and materials such as SMT, Die Attach, Wire Bond / Flip Chip, Molding, Multi-layer laminates, etc. is a plus.
Recognized understanding of IPC laminate/PCB standards
Strong background in laminate/PCB design rules, manufacturing and qualification standards.
Effective project management skills
Proven record of accomplishment in supporting New Product / Processes and/or Technology through innovative packaging solutions
Fluent in Korean and English.

Benefits

Comp & perks

Health insurance
401(k) matching

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

PCB manufacturingmSAP laminate manufacturingCu pattern platingpanel platingsurface finishesSMTDie AttachWire BondFlip Chipmulti-layer laminates

Soft Skills

strong communication skillsproblem solving skillseffective project management skills