
Principal Design Engineer
Qorvo, Inc.
full-time
Posted on:
Location Type: Office
Location: Apopka • Florida • United States
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Job Level
Tech Stack
About the role
- Technical ownership of RF module design and development projects from inception to production release; meeting technical performance, schedule and cost goals for NPI (New Product Introduction)
- Performing circuit level design of RF sub-systems, EM simulations, impedance matching circuits, chain analysis including investigation of variations etc. of RF modules to ensure first pass success of designs
- Support preparation of technical proposals to customers
- Work closely with project managers to make sure key project milestones are met
- Prepare and own internal documentation related to design, prepare and present various technical and project reviews internally and to external customers
- Working closely with test engineering personnel to characterize prototypes and product samples, and lead design optimization for performance, yield, reliability and cost
Requirements
- MS or PhD in Electrical Engineering or Physics with a focus on RF Design/Electromagnetics
- 10+ years of RF module design experience required
- Solid understanding of fundamentals of RF/Microwave module design including circuit and electromagnetics level simulations
- Good understanding of radio systems and building blocks such as LNAs, PA's, RF switches, attenuators, filters etc.
- Require very good working knowledge of RF simulation tools such as Keysight ADS, HFSS, AWR (desired)
- Familiarity with multilayer laminate/PCB layout
- Very good theoretical understanding and industry and/or academic hands-on experience with impedance matching techniques and matching circuit design, implementation and test bench level tuning
- Ability to create 3D circuit models using EM tools and run simulations on RF/Microwave structures and translate between the model, simulation, physical implementation, and measured performance required
- Good working knowledge of RF test techniques for noise, s-parameters, linearity and lab equipment such as Vector Network Analyzer, Spectrum Analyzer, Oscilloscopes etc.
- Experience with IPD (Integrated Passive Device) die design for implementing baluns, couplers etc.
- Working knowledge of multi-chip module (MCM) packaging processes - soldering, wire bonding, die attach, thermal management etc. (desired)
- Previous experience with passive RF components - filters, couplers etc. - desired
- Understanding of MMIC technologies such as GaAs, RF SOI, GaN desired
- Exposure to MMIC design highly desired
- Previous experience with high rejection/high isolation filter design and implementation is highly desired
- Programming experience with Python and/or Matlab especially for Machine Learning highly desired
- Must be an excellent results-driven team player, have willingness and ability to learn new skills and technologies
- Good written and oral communication skills required
- Ability to work effectively and efficiently across diverse engineering, product management, marketing and manufacturing teams.
Benefits
- Equal Employment Opportunity (EEO) employer
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
RF module designcircuit level designEM simulationsimpedance matchingRF/Microwave simulations3D circuit modelingRF test techniqueshigh rejection filter designprogramming in Pythonprogramming in Matlab
Soft Skills
results-driventeam playerwillingness to learngood written communicationgood oral communicationeffective collaborationorganizational skills
Certifications
MS in Electrical EngineeringPhD in Electrical EngineeringMS in PhysicsPhD in Physics