Packaging Engineer
Qorvo, Inc.
full-time
Posted on:
Location Type: Office
Location: Barcelona • 🇪🇸 Spain
Visit company websiteJob Level
Mid-LevelSenior
About the role
- Conduct thermal, mechanical, and thermo-mechanical FEA simulations for various Qorvo devices and package types
- Develop and refine simulation methodologies to enhance speed and accuracy
- Support business units with mechanical engineering expertise
- Identify potential quality risks and propose effective solutions
- Optimize model size, detail, and generation processes to reduce simulation cycle times
- Collaborate with cross-functional teams across Qorvo to drive technology improvements
Requirements
- Masters degree in Physics, Mechanical/Electrical Engineering, Material Science, or related field
- Strong understanding of thermal physics and processes
- Experience with FEA/FEM simulation tools
- Excellent presentation and communication skills
- Proven ability to work effectively in a global, collaborative environment
- Proficiency in packaging and semiconductor technologies
- Ph.D. in Physics, Mechanical/Electrical Engineering, Material Science, or related field (preferred)
- Experience in packaging engineering, mechanical or materials engineering, reliability engineering, or a related technical field, with a focus on simulation, modeling, or process optimization (preferred)
- Hands-on experience with Ansys Mechanical (preferred)
- Basic knowledge of RF circuit design (preferred)
Benefits
- Equal Employment Opportunity (EEO) employer
- Fair and impartial consideration
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
thermal physicsmechanical engineeringthermo-mechanical FEAsimulation methodologiesmodel optimizationpackaging engineeringreliability engineeringprocess optimizationRF circuit design
Soft skills
presentation skillscommunication skillscollaborative work
Certifications
Masters degreePh.D.