Staff Mechanical-Thermal Design Engineer
Qorvo, Inc.
full-time
Posted on:
Location Type: Office
Location: Richardson • Texas • 🇺🇸 United States
Visit company websiteJob Level
Lead
Tech Stack
Assembly
About the role
- Staff level Mechanical/Thermal Engineer developing next generation microelectronic packaging technology with emphasis on thermal analysis
- Chosen candidate will work closely with select team of IC designers, circuit designers, process engineers, and CAD tool set specialists to develop products and development tools to move state of the art packaging technology forward
- Using FEA and other industry standard simulations tools: Perform detailed modeling and optimization of thermal design at the die/package/board level
- Perform mechanical stress modeling and optimization at the die/package/board level
- Develop and execute thermal measurement techniques to support analysis for internal and external customers
- Guide package and substrate design decisions that meet performance specifications and yield requirements
- Supervise and respond to manufacturing issues as they occur
- Maintain view of packaging technology trends across GaN, GaAs, Digital Si, and Analog Si.
- Provide inputs to implement these technology trends
- Support external customers with applications thermal models and failure analysis support
Requirements
- BSME/MSME degree in mechanical engineering or other relevant field with a minimum of 8 years’ experience in semiconductor packaging
- Experience in the design of packaged microelectronic assemblies for the defense, avionics, aerospace, or automotive industries
- Expert level skill with ANSYS and Solidworks, or similar
- Knowledge of legacy and advanced microelectronic package technologies for commercial, defense, and aerospace markets including materials, manufacturing methods, plating, sealing, and interconnect technologies
- Experience with microelectronic package assembly processes including die attach, wire bond, flip chip, epoxy dispense, encapsulation, and solder reflow
- Knowledge of microelectronic inspection tools and equipment including capabilities and limitations. Similar knowledge of failure analysis techniques and equipment
- Knowledge of reliability calculation methods for semiconductors
- Understanding of GD&T, ANSI standards and tolerance stack-ups required
- Demonstrated ability to work with cross-functional teams
- Excellent verbal communication and interpersonal skills
- Excellent written communications skills
Benefits
- Equal Employment Opportunity (EEO) employer
- Fair and impartial consideration for applicants
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
thermal analysisFEAmechanical stress modelingthermal measurement techniquesANSYSSolidworksmicroelectronic package technologiesreliability calculation methodsGD&Tfailure analysis techniques
Soft skills
cross-functional teamworkverbal communicationinterpersonal skillswritten communication
Certifications
BSMEMSME