Senior Mechanical Design Engineer
Qorvo, Inc.
full-time
Posted on:
Location Type: Office
Location: Richardson • Texas • 🇺🇸 United States
Visit company websiteJob Level
Senior
Tech Stack
Assembly
About the role
- Lead mechanical design and development efforts of RF power amplifiers for defense communications
- Develop next generation microelectronic packaging technology
- Perform detailed modeling and optimization of thermal/mechanical design
- Guide package and substrate design decisions
- Develop and document new products for prototype and production release
- Supervise and respond to manufacturing issues
- Maintain view of packaging technology trends
- Support external customers with thermal models and failure analysis
Requirements
- BSME/MSME degree in mechanical engineering or other relevant field
- Minimum of 5 years’ experience in semiconductor packaging
- Expert level skill with ANSYS and Solidworks, or similar
- Knowledge of microelectronic package technologies for commercial, defense, and aerospace markets
- Experience with microelectronic package assembly processes
- Understanding of GD&T, ANSI standards and tolerance stack-ups
- Demonstrated ability to work with cross-functional teams
- Excellent verbal and written communication skills
Benefits
- Health insurance
- 401(k) matching
- Flexible work hours
- Paid time off
- Professional development opportunities
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
mechanical designRF power amplifiersmicroelectronic packagingthermal modelingANSYSSolidworksmicroelectronic package assemblyGD&TANSI standardstolerance stack-ups
Soft skills
leadershipcommunicationcross-functional teamworkproblem-solving
Certifications
BSMEMSME