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NXP Semiconductors

Senior Field Application Engineer – MPU, DNPU, Robotics, Drones

NXP Semiconductors

Senior Field Application Engineer supporting robotics solutions focusing on NXP MPU and DNPU processors. Responsible for technical leadership and customer partnerships in EMEA regions including Munich and Bucharest.

Posted 6/30/2026full-timeMunich • 🇩🇪 GermanySeniorWebsite

Tech Stack

Tools & technologies
LinuxPython

About the role

Key responsibilities & impact
  • Provide technical leadership to sales teams and customers covering edge-compute architecture, processor selection, bring-up, and software stack integration for NXP MPU and DNPU processors targeting robotics platforms.
  • Partner with customers on the design of companion computers, central compute, vision/perception subsystems, and HMI nodes — from silicon selection through Linux board bring-up, kernel/driver enablement, and system performance tuning.
  • Design support and lab troubleshooting through schematic reviews, bench bring-up, debugging, and root-cause analysis across hardware, kernel, drivers, and middleware.
  • Enable customer AI, vision, and sensor-fusion workloads on NXP processors and integrated NPUs, helping customers move models from training frameworks to optimized on-device inference for perception, navigation, and HMI use cases.

Requirements

What you’ll need
  • Master’s degree in Electrical Engineering, Computer Engineering or Computer Science
  • 10+ years in embedded systems development or applications support of MPU / SoC-based platforms running embedded Linux, with demonstrated technical leadership.
  • Strong embedded Linux experience across the full stack: bootloader (u-boot), kernel and device drivers, device tree, Yocto / build system, and user-space integration.
  • Working knowledge of Python or scripting for tooling and automation.
  • Hands-on experience with ARM Cortex-A class application processors and heterogeneous compute architectures pairing application cores with real-time microcontroller cores.
  • Working knowledge of high-speed application-processor interfaces and how to design around them: LPDDR, PCIe, USB 3.x, MIPI-CSI / MIPI-DSI, Gigabit / Multi-Gigabit Ethernet, SDIO / eMMC, and QSPI.
  • Excellent verbal and written communication for both technical and non-technical stakeholders.
  • Willingness to travel
  • Fluent English required.

Benefits

Comp & perks
  • Career Development Opportunities
  • Commitment to sustainability and inclusivity

ATS Keywords

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Hard Skills & Tools
Embedded LinuxBootloader (U-Boot)Kernel and Device DriversDevice TreeYocto / Build SystemPython ScriptingARM Cortex-A ProcessorsHeterogeneous Compute ArchitecturesHigh-Speed Application-Processor InterfacesSystem Performance Tuning
Soft Skills
Excellent CommunicationCollaboration with Stakeholders
Certifications
Master’s Degree in Electrical EngineeringMaster’s Degree in Computer EngineeringMaster’s Degree in Computer Science