Systems IC Architect

NXP Semiconductors

. Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions .

Posted 5/17/2026full-timeAustin • California, Texas • 🇺🇸 United StatesSeniorLeadWebsite

About the role

Key responsibilities & impact

Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions
Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams
Translate customer requirements into innovative packaging and power management solutions
Support development through thermal optimization and electrical analysis
Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets
Lead integration of ICs and power semiconductors into advanced packages and systems
Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms
Provide strategic insights on state-of-the-art power management technologies and benchmark readiness
Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability
Report KPIs and project status to executive stakeholders

Requirements

What you’ll need

Master’s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred)
15+ years of experience in power semiconductors, packaging, and system-level integration
Expertise in System-in-Package (SiP) integration
Proven track record in product definition through revenue realization
Strong expertise in thermal management, electrical performance, and advanced reliability
Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS)
Knowledge of PCB materials and stack-up
Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued
Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508)
Demonstrated ability to lead cross-functional, global teams and manage complex projects
Excellent communication and interpersonal skills; ability to collaborate across diverse teams
Creative mindset with strong problem-solving capabilities
Willingness to travel globally

Benefits

Comp & perks

Competitive salary
Flexible working hours
Professional development opportunities

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

System IC Architecturepower semiconductor modulesSystem-in-Package (SiP) solutionsthermal managementelectrical performancecircuit simulationPCB materialspower efficiencyadvanced reliabilityAI compute

Soft Skills

lead cross-functional teamsmanage complex projectsexcellent communicationinterpersonal skillscollaborate across teamscreative mindsetproblem-solving capabilities

Certifications

Master’s degree in Power ElectronicsMaster’s degree in Electrical EngineeringPh.D. in related fieldISO26262IEC61508