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NXP Semiconductors

Systems IC Architect

NXP Semiconductors

System IC Architect at NXP defining products and shaping architecture strategy in power management. Expertise in AI compute power and automotive applications is essential.

Posted 5/17/2026full-timeAustin • California, Texas • 🇺🇸 United StatesSeniorLeadWebsite

About the role

Key responsibilities & impact
  • Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions
  • Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams
  • Translate customer requirements into innovative packaging and power management solutions
  • Support development through thermal optimization and electrical analysis
  • Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets
  • Lead integration of ICs and power semiconductors into advanced packages and systems
  • Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms
  • Provide strategic insights on state-of-the-art power management technologies and benchmark readiness
  • Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability
  • Report KPIs and project status to executive stakeholders

Requirements

What you’ll need
  • Master’s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred)
  • 15+ years of experience in power semiconductors, packaging, and system-level integration
  • Expertise in System-in-Package (SiP) integration
  • Proven track record in product definition through revenue realization
  • Strong expertise in thermal management, electrical performance, and advanced reliability
  • Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS)
  • Knowledge of PCB materials and stack-up
  • Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued
  • Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508)
  • Demonstrated ability to lead cross-functional, global teams and manage complex projects
  • Excellent communication and interpersonal skills; ability to collaborate across diverse teams
  • Creative mindset with strong problem-solving capabilities
  • Willingness to travel globally

Benefits

Comp & perks
  • Competitive salary
  • Flexible working hours
  • Professional development opportunities

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools
System IC Architecturepower semiconductor modulesSystem-in-Package (SiP) solutionsthermal managementelectrical performancecircuit simulationPCB materialspower efficiencyadvanced reliabilityAI compute
Soft Skills
lead cross-functional teamsmanage complex projectsexcellent communicationinterpersonal skillscollaborate across teamscreative mindsetproblem-solving capabilities
Certifications
Master’s degree in Power ElectronicsMaster’s degree in Electrical EngineeringPh.D. in related fieldISO26262IEC61508