Principal Applications Engineer

NXP Semiconductors

Principal Applications Engineer at NXP working with Automotive SerDes solutions. Collaborating with engineering teams to improve product features and customer adoption in high-speed data communication.

Posted 5/17/2026full-timeSan Jose • California, Texas • 🇺🇸 United StatesLeadWebsite

Tech Stack

Tools & technologies

Switching

About the role

Key responsibilities & impact

Collaborate with IC design, systems, FW, and test teams to translate field issues and customer requirements into product improvements and new features.
Review customer schematics and layouts for signal‑integrity and power‑integrity best practices.
Lead board‑level bring‑up and validation using oscilloscopes, protocol analyzers; generate test reports and recommendations.
Provide on‑site or remote debug support for complex customer issues.
Develop and maintain application collateral: reference designs, layout guidelines, design checklists, characterization reports, application notes, training materials.
Participate in trade shows and provide FAE training

Requirements

What you’ll need

Bachelor’s degree or above in Electrical/Electronic Engineering or related field
Extensive experience (12+ years) in hardware design, applications engineering, or system validation
Familiarity with high-speed data communication protocols and interfaces, including Ethernet networking and switching, MIPI CSI-2, and display protocols (DP/eDP)
Strong understanding of high-speed SerDes fundamentals: channel loss, reflections, return loss, insertion loss, ISI, jitter, equalization, and clocking
Demonstrated experience with multi-Gbps serial links (e.g., Ethernet, PCIe, DP, USB3.x/USB4, proprietary SerDes)
Proficiency with SI/PI tools and simulations (e.g., S-parameter analysis, eye/jitter simulations) and comfort interpreting simulation and measurement correlation
Hands-on experience using lab equipment: high-bandwidth oscilloscopes, TDR, VNA, BERT, protocol analyzers, logic analyzers, and related tools
Strong skills in PCB design for high-speed: layer stack-up, routing constraints, differential pairs, reference planes, decoupling, and power delivery
Excellent communication and presentation skills to explain complex technical topics to both expert and non-expert audiences.
Ability to work effectively with global, cross-functional teams (design, systems, test, marketing, field).

Benefits

Comp & perks

Bright Minds. Bright Futures.
Professional development opportunities
Commitment to sustainability and inclusion programs.

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

hardware designapplications engineeringsystem validationhigh-speed data communication protocolshigh-speed SerDes fundamentalsmulti-Gbps serial linksSI/PI tools and simulationsPCB design for high-speedsignal integritypower integrity

Soft Skills

communication skillspresentation skillscollaborationproblem-solvingteamwork

Certifications

Bachelor’s degree in Electrical/Electronic Engineering