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NXP Semiconductors

Principal Applications Engineer

NXP Semiconductors

. Collaborate with IC design, systems, FW, and test teams to translate field issues and customer requirements into product improvements and new features.

Posted 5/17/2026full-timeSan Jose • California, Texas • 🇺🇸 United StatesLeadWebsite

Tech Stack

Tools & technologies
Switching

About the role

Key responsibilities & impact
  • Collaborate with IC design, systems, FW, and test teams to translate field issues and customer requirements into product improvements and new features.
  • Review customer schematics and layouts for signal‑integrity and power‑integrity best practices.
  • Lead board‑level bring‑up and validation using oscilloscopes, protocol analyzers; generate test reports and recommendations.
  • Provide on‑site or remote debug support for complex customer issues.
  • Develop and maintain application collateral: reference designs, layout guidelines, design checklists, characterization reports, application notes, training materials.
  • Participate in trade shows and provide FAE training

Requirements

What you’ll need
  • Bachelor’s degree or above in Electrical/Electronic Engineering or related field
  • Extensive experience (12+ years) in hardware design, applications engineering, or system validation
  • Familiarity with high-speed data communication protocols and interfaces, including Ethernet networking and switching, MIPI CSI-2, and display protocols (DP/eDP)
  • Strong understanding of high-speed SerDes fundamentals: channel loss, reflections, return loss, insertion loss, ISI, jitter, equalization, and clocking
  • Demonstrated experience with multi-Gbps serial links (e.g., Ethernet, PCIe, DP, USB3.x/USB4, proprietary SerDes)
  • Proficiency with SI/PI tools and simulations (e.g., S-parameter analysis, eye/jitter simulations) and comfort interpreting simulation and measurement correlation
  • Hands-on experience using lab equipment: high-bandwidth oscilloscopes, TDR, VNA, BERT, protocol analyzers, logic analyzers, and related tools
  • Strong skills in PCB design for high-speed: layer stack-up, routing constraints, differential pairs, reference planes, decoupling, and power delivery
  • Excellent communication and presentation skills to explain complex technical topics to both expert and non-expert audiences.
  • Ability to work effectively with global, cross-functional teams (design, systems, test, marketing, field).

Benefits

Comp & perks
  • Bright Minds. Bright Futures.
  • Professional development opportunities
  • Commitment to sustainability and inclusion programs.

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools
hardware designapplications engineeringsystem validationhigh-speed data communication protocolshigh-speed SerDes fundamentalsmulti-Gbps serial linksSI/PI tools and simulationsPCB design for high-speedsignal integritypower integrity
Soft Skills
communication skillspresentation skillscollaborationproblem-solvingteamwork
Certifications
Bachelor’s degree in Electrical/Electronic Engineering