NXP Semiconductors

System IC Architect – Advanced Power Systems

NXP Semiconductors

full-time

Posted on:

Location Type: Hybrid

Location: San JoseCaliforniaUnited States

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About the role

  • Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions
  • Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams
  • Translate customer requirements into innovative packaging and power management solutions
  • Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets
  • Lead integration of ICs and power semiconductors into advanced packages and systems
  • Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability
  • Collaborate with system, modeling, design, packaging and manufacturing engineering teams to validate and optimize high-performance compute Power designs
  • Provide strategic insights on state-of-the-art power management technologies and benchmark readiness

Requirements

  • Master’s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred)
  • 15+ years of experience in power semiconductors, packaging, and system-level integration
  • Expertise in System-in-Package (SiP) integration
  • Proven track record in product definition through revenue realization
  • Strong expertise in thermal management, electrical performance, and advanced reliability
  • Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS)
  • Knowledge of PCB materials and stack-up
  • Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued
  • Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508)
  • Demonstrated ability to lead cross-functional, global teams and manage complex projects
  • Excellent communication and interpersonal skills
Benefits
  • Health insurance
  • Professional development opportunities
  • Flexible working arrangements
  • Remote work options
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
System IC Architecturepower semiconductor modulesSystem-in-Package (SiP) solutionsthermal managementcircuit simulationPCB materialshigh performance compute SoC platformsproduct definitionpower management technologiesadvanced reliability
Soft Skills
lead cross-functional teamsmanage complex projectsexcellent communicationinterpersonal skills
Certifications
Master’s degree in Power ElectronicsMaster’s degree in Electrical EngineeringPh.D. in related fieldISO26262IEC61508