Develop novel III-V devices and their packaging implementation.
Manage supplier ecosystems and optimize devices and packaging for manufacturability and reliability.
Contribute to system-level optimization and product strategy.
Be motivated by making the world a better place through technology, and wanting to be part of a team that makes this happen.

Requirements

M.S. in Electrical Engineering, Applied Physics, Materials Science or related field
Five (5) or more years relevant industry experience with demonstrated achievements in III-V development
Experience with III-V DFB and SOA modeling, characterization, and packaging implementation.
Experience with photonic simulation software (PICS3D, Lumerical, PhotonD or equivalent)
Experience working with III-V foundries, suppliers, and assembly and test vendors.
Experience with optimization of III-V devices and packaging towards manufacturability and reliability.
Experience with III-V DFB & SOA failure analysis, and parts inspection.

Benefits

equity
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Applicant Tracking System Keywords

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Hard Skills & Tools

III-V devices developmentpackaging implementationDFB modelingSOA modelingcharacterizationphotonic simulation softwarefailure analysisparts inspectionoptimization of devicesmanufacturability

Soft Skills

team collaborationmotivation for technology impact

Certifications

M.S. in Electrical EngineeringM.S. in Applied PhysicsM.S. in Materials Science