Principal, IC Package Engineer

Microchip Technology Inc.

IC Package Engineer designing high-speed products in the Mixed Signal Development Group at Microchip. Conducting complex package routing and collaborating with engineers for manufacturability.

Posted 7/29/2026full-timeBangalore • 🇮🇳 IndiaLeadWebsite

Core Competencies

Role fit

Core Competencies

Use this summary to align your resume positioning with the role.

Demonstrates expertise in package design, particularly using Cadence APD, with a strong focus on high-speed signal routing and manufacturability. Capable of managing complex design schedules and collaborating with internal and external teams to ensure design integrity and customer satisfaction.

Highest-signal resume keywords

Cadence APD ExpertisePackage Design Rules AuthoringHigh Speed Signal RoutingPCB Design FamiliarityCustomer Orientation

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Package DesignSignal Integrity RoutingScripting in PERLScripting in SKILLPCB Breakout StudiesFlip Chip DesignWire Bond DesignBGA Fanout IssuesDesign Schedule ManagementPackage Routing Constraints

Soft Skills

Attention to DetailMulti-tasking

Certifications & Qualifications

Bachelor’s DegreeMaster’s Degree

Industry Keywords

Microchip ProductsMCM PackagesManufacturabilityPackage Routing ReportsExternal Design Teams

Tech Stack

Tools & technologies

Perl

About the role

Key responsibilities & impact

Conduct package routing feasibility and substrate layouts for Microchip high-speed products, including MCM packages
Perform simple PCB breakout studies for ball map feasibility
Identify key issues for proposed designs based on silicon floor plans and desired package sizes
Work with signal integrity engineers to implement high speed signal routes and quiet power routes
Work with reliability engineers and external vendors to ensure manufacturability of package designs
Create package routing constraints based on signal integrity routing rules
Interact with and oversee work of external and internal package designers
Produce package routing reports and diagrams for review by external teams
Create and track package design schedules
Guide and assist external design teams on creation of input data for package design flow.

Requirements

What you’ll need

Applicable Bachelor’s or Master’s Degree
10+ years of industry experience
Expert in package design using Cadence APD
Expert in authoring APD design rules
Scripting in PERL or SKILL is an asset
Familiarity with flip chip and wire bond package designs
Familiarity with PCB design and BGA fanout issues
Understanding of high speed and power routing rules/issues
Capable of handling multiple tasks at once
Customer oriented, with attention to detail

Benefits

Comp & perks

Employee development
Opportunity for professional growth
Leadership Passage Programs