Microchip Technology Inc.

Principal Engineer – Product

Microchip Technology Inc.

full-time

Posted on:

Location Type: Office

Location: Austin • Texas • United States

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Job Level

Lead

Tech Stack

SQL

About the role

  • Own New Product Development from design phase through mass production
  • Work with Architecture, Design, Marketing, Software, Test, Planning and Manufacturing teams to achieve common goal of successful product launch
  • Interface with internal teams and external suppliers to resolve manufacturing issues that are technical (fab, test, design related) and non-technical (supply chain, finance, system related)
  • Work with Applications and Quality Engineering teams to support customer returns and failure analysis
  • Drive continuous improvement in product quality and cost

Requirements

  • B.S. in Engineering or related field with 10+ years of relevant experience.
  • Outstanding written and verbal skills with a focus on attention to detail.
  • Ability to communicate to all levels (individual contributor to VP level) and various positions (planning, customer support, R&D Engineering, etc).
  • Experience with leading global teams through complex projects.
  • Flexibility to communicate with different time zones as needed.
  • Semiconductor packaging technology knowledge a plus (QFN, FCBGA, ...).
  • Automotive support knowledge with emphasis on die and package qualification.
  • Good understanding of semiconductor device physics and processing.
  • Strong analytical skills to analyze validation data, ATE datalogs and fab electrical test data.
  • Ability to comprehend and review design objective specifications and data sheets.
  • Knowledge with USB, PCI and Ethernet desirable but not required.
  • Customer facing experience is a plus.
  • Coding in C++, Visual Basic, SQL is a plus.
Benefits
  • Employee development programs
  • Leadership Passage Programs
  • Recognition for diversity and workplace excellence
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
New Product DevelopmentSemiconductor packaging technologyDie qualificationPackage qualificationSemiconductor device physicsValidation data analysisATE datalogs analysisC++Visual BasicSQL
Soft Skills
Outstanding written skillsOutstanding verbal skillsAttention to detailCommunication skillsLeadershipFlexibilityAnalytical skillsCustomer facing experienceTeam collaborationProject management