Principal Thermal Engineer – AI System

Hyve Solutions

Principal Thermal Engineer designing, testing, and debugging thermal solutions for next-generation AI and GPU servers. Focusing on hands-on thermal design from concept to production.

Posted 7/22/2026full-timeFremont • California • 🇺🇸 United StatesLeadWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in system-level thermal design, including airflow optimization and liquid cooling solutions for high-power electronics. Proficient in thermal modeling and validation, with a strong focus on collaboration across engineering teams to ensure effective thermal methodologies.

Highest-signal resume keywords

Thermal Design EngineeringCFD ModelingLiquid Cooling SystemsAirflow OptimizationThermal Methodology Development

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Thermal DesignCFD Modeling ToolsLiquid Cooling SolutionsAir-Cooled SystemsHigh-Power ElectronicsThermal ValidationDebugging Physical SystemsThermal-Power-Reliability RelationshipsCharacterization TestingRoot-Cause Analysis

Soft Skills

Clear CommunicationProblem OwnershipMentoring Engineers

Certifications & Qualifications

Bachelor's in Mechanical EngineeringMaster's in Thermal Engineering

Industry Keywords

High-Power GPUsHPC SystemsHyperscale DeploymentDirect-to-Chip CoolingManufacturing Ramp

Tech Stack

Tools & technologies

Airflow

About the role

Key responsibilities & impact

Own system-level thermal design from early concept through production, optimizing airflow, heatsinks, cold plates, heat exchangers, and liquid cooling hardware for very high-power GPUs, CPUs, VRs, and memory.
Design direct-to-chip liquid cooling solutions (cold plates, manifolds, tubing, quick-disconnects), support hybrid platforms, and own airflow design including fan selection, ducting, zoning, and impedance reduction.
Perform thermal and CFD modeling to guide placement and layout, instrument systems for validation, execute characterization and margin testing under real AI workloads, and correlate simulation with lab data.
Lead thermal bring-up across EVT/DVT/PVT, debug hotspots, instability, and flow anomalies, and drive root-cause analysis with permanent fixes through factory ramp and field deployment.
Work closely with mechanical, hardware, power, firmware, SI, and manufacturing teams to ensure thermal considerations are embedded into board layouts, mechanical stackups, and rack packaging; set thermal methodology and mentor engineers.

Requirements

What you’ll need

Bachelor's or Master's in Mechanical Engineering, Thermal Engineering, or a related discipline.
10+ years of hands-on thermal design for servers, GPU platforms, HPC systems, or high-power electronics, with proven delivery of air-cooled and/or liquid-cooled systems into production and direct involvement in bring-up, validation, and manufacturing ramp.
Hyperscale deployment experience strongly preferred.
Strong hands-on knowledge of airflow and thermal design for high-power servers, direct-to-chip liquid cooling systems, cold plates/pumps/manifolds/heat exchangers, and CFD/thermal modeling tools; deep understanding of thermal-power-reliability relationships in AI/GPU systems.
Strong individual contributor able to own problems end-to-end, comfortable debugging physical systems in the lab, and a clear communicator who translates thermal data into actionable design changes.

Benefits

Comp & perks

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