Fraunhofer IIS

Engineer for Universal Components and Chiplet Integration

Fraunhofer IIS

full-time

Posted on:

Location Type: Hybrid

Location: Dresden • Germany

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About the role

  • You conceive and develop methods and chiplet components for the complex hardware of tomorrow
  • You contribute innovative ideas that improve the design of heterogeneous electronic systems in many respects
  • You are responsible for adapting and integrating IPs and components
  • Support pilot users from industry and research in rapid prototype development
  • Specification and development of universal components for chiplet-based systems
  • Adaptation and combination of existing IPs to realize functional chiplet components
  • Design, verification and implementation of components using hardware description languages (HDL)
  • Execution of the IC design process from HDL to GDSII, including synthesis, timing closure and physical verification

Requirements

  • Degree in Electrical Engineering, Computer Science, Physics, or a related field
  • Practical experience in chip design and ideally experience in package design
  • Very good German and English, both written and spoken
  • Team-player personality with an independent working style and goal-oriented communication
  • Confident use of chip design and/or test tools
  • Knowledge of specification, design and verification for RISC-V and FPGAs
  • Ability to adapt and integrate existing IPs into new designs
  • Experience in the IC design process, including physical verification and equivalence checking
  • Knowledge of digital implementation and consideration of parasitic (package) effects
  • Experience with testing methods to improve silicon die testability
  • Ideally experience in system modeling and simulation using open-source tools
  • Ideally the ability to specify requirements and protocol definitions for interface components
Benefits
  • Scientific excellence meets industry
  • Meaningful work
  • Respect and appreciation
  • Work-life balance
  • Targeted training and development of your professional and personal strengths through seminars, coaching and language courses
  • Space for interaction and collaboration
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
chip designpackage designhardware description languages (HDL)IC design processsynthesistiming closurephysical verificationRISC-VFPGAsdigital implementation
Soft Skills
team-playerindependent working stylegoal-oriented communication